This paper introduces a novel approach called ultra-high-frequency (UHF) induction-assisted laser wire deposition. This method utilizes induction heat as an auxiliary source to create a high-temperature zone on the substrate’s surface, just ahead of where the metal is deposited. This ensures a strong metallurgical bond between the deposited track and substrate, while the metal wire is also preheated by the induction heat, which helps distribute heat more evenly in the part generated by the high-power laser. To gain insights into the deposition process, we establish a numerical model that combines temperature and electromagnetic fields. Thus, the penetration depth of the deposited track can be predicted through numerical simulation to control dilution rates effectively.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.