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Sungmin Park
at SAMSUNG Electronics Co Ltd
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Publications (1)
Proceedings Article | 16 March 2016 Paper
Interlayer design verification methodology using contour image
Seoksan Kim, Seiryung Choi, Namjung Kang, Hyunju Sung, Jinwoo Choi, Jaepil Shin, Jaekyun Park, Myoungseob Shim, Kyupil Lee, Hyeongsun Hong, Minyoung Shim, Sungmin Park
Proceedings Volume 9781, 97810V (2016) https://doi.org/10.1117/12.2218477
KEYWORDS: Statistical analysis, Nondestructive evaluation, Inspection, Semiconducting wafers, Bridges, Visualization, Design for manufacturability, Manufacturing, Neodymium, Etching, Semiconductors, Electronics
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