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Wen-Han Chu
at TSMC
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Publications (1)
Proceedings Article | 18 March 2015 Paper
Impacts of post OPC shapes on pattern
W. H. Chu, Y. T. Tsai, S. Y. Huang, C. C. Kuo, H. T. Lin
Proceedings Volume 9426, 94261S (2015) https://doi.org/10.1117/12.2087531
KEYWORDS: Optical proximity correction, Photomasks, Diffraction, Shape analysis, Spatial frequencies, Resolution enhancement technologies, Head, Optical lithography, Semiconducting wafers, Lithographic illumination
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