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Yoshiharu Sakurai
at Merck Electronics Ltd
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Author
Publications (1)
Proceedings Article | 1 May 2023 Poster + Paper
Positive tone i-line photoresist with controlled undercut profile for advanced packaging
Proceedings Volume 12498, 124981K (2023) https://doi.org/10.1117/12.2657694
KEYWORDS: Photoresist materials, Copper, Semiconducting wafers, Film thickness, Advanced packaging, Metals, Plating, Baking, Silicon, Photoresist processing
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