We have successfully demonstrated a diaphragm-type pneumatic valve capable of amplifying electrostatic actuation and attenuating air pressure applied onto the diaphragm. When a high voltage is applied between the flexible electrode coated on top of the diaphragm and an underneath ground electrode, the electrostatic attraction induces a zipping motion of the diaphragm. The actuation of the pneumatic valve can seal an air chamber and maintain its internal pressure at a high level, which drives a circular elastomer membrane to form a bump and stimulate the skin. If the applied voltage falls below a certain threshold, air bypasses the diaphragm to the atmosphere and causes a sharp drop of the inter pressure, whose magnitude is controlled by a dedicated fluidic resistor located upstream. By manipulating pressure, the electrically-driven valve can control the movement of the membrane and the stimulation to the skin. In the prototype demonstration, structures are 3D manufactured, selectively coated with silver electrodes, and integrated to realize the proposed actuator with 1 cm3 in volume. The fabricated circular elastomer membrane of 3 mm in diameter and 0.1 mm in thickness forms a bump of 0.5 mm in height under an air pressure of 10 kPa, which requires a voltage of >472 V for the valve to maintain. While the voltage is lower than 472 V, the pressure drops and the membrane moves down. Once a voltage of >814 V is applied, it seals the chamber and forms the bump again. Therefore, haptic actuation can be generated as desired.
Conference Committee Involvement (13)
Micromachining and Microfabrication Process Technology XIX
5 February 2014 | San Francisco, California, United States
Micromachining and Microfabrication Process Technology XVIII
5 February 2013 | San Francisco, California, United States
Micromachining and Microfabrication Process Technology XVII
25 January 2012 | San Francisco, California, United States
Micromachining and Microfabrication Process Technology XVI
25 January 2011 | San Francisco, California, United States
Micromachining and Microfabrication Process Technology XV
26 January 2010 | San Francisco, California, United States
Micromachining and Microfabrication Process Technology XIV
27 January 2009 | San Jose, California, United States
Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems IV
10 December 2008 | Melbourne, Australia
Micromachining and Microfabrication Process Technology XIII
22 January 2008 | San Jose, California, United States
Micromachining and Microfabrication Process Technology XII
22 January 2007 | San Jose, California, United States
Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems III
11 December 2006 | Adelaide, Australia
Micromachining and Microfabrication Process Technology XI
25 January 2006 | San Jose, California, United States
Device and Process Technologies for Microelectronics, MEMS, and Photonics IV
12 December 2005 | Brisbane, Australia
Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems II
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