Paper
30 January 1989 Positive-Working Polyimide Resists Based On Diazonaphthoquinone Photochemistry
Mary G. Moss, Ruth M. Cuzmar, Terry Brewer
Author Affiliations +
Abstract
Polyimides have many desirable properties for use in the microelectronics industry, including ease of application, excellent planarization capability, and good electrical insulating properties. A polyamic acid that is also an imagable resist simplifies processing by eliminating the need for separate resist application and removal steps. Negative-working polyimide resists are quite common, but there are very few examples of positive-working polyimide-based resists. In this paper, we describe a positive polyimide resist which is based upon a diazonaphthoquinone dissolution inhibitor that is standard in the resist industry. The positive polyimide resist described here has high resolution, high heat resistance, and excellent dielectric properties.
© (1989) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mary G. Moss, Ruth M. Cuzmar, and Terry Brewer "Positive-Working Polyimide Resists Based On Diazonaphthoquinone Photochemistry", Proc. SPIE 1086, Advances in Resist Technology and Processing VI, (30 January 1989); https://doi.org/10.1117/12.953052
Lens.org Logo
CITATIONS
Cited by 6 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Polymers

Dielectrics

Photoresist materials

Absorbance

Semiconducting wafers

Photochemistry

Bismuth

Back to Top