High-speed electronic speckle pattern interferometry for analysis of thermo-mechanical behavior of electronic components

G. Laskin; H. Huai; M. Fratz; T. Seyler; T. Beckmann; A. Schiffmacher; A. Bertz; J. Wilde; D. Carl

doi:10.1117/12.2592024

20 June 2021 High-speed electronic speckle pattern interferometry for analysis of thermo-mechanical behavior of electronic components

G. Laskin, H. Huai, M. Fratz, T. Seyler, T. Beckmann, A. Schiffmacher, A. Bertz, J. Wilde, D. Carl

Author Affiliations +

Proceedings Volume 11782, Optical Measurement Systems for Industrial Inspection XII; 117820A (2021) https://doi.org/10.1117/12.2592024
Event: SPIE Optical Metrology, 2021, Online Only

Abstract

The electronics industry is creating complex miniaturized devices with steadily higher power density. The increase of maximum operating temperatures affects the thermo-mechanical load and imposes greater requirements on the quality of electronic packages. Fast and reliable methods for inspecting the quality of electronic components can help to improve production quality and to reduce waste and environmental burden. We present a compact optical sensor based on Electronic Speckle Pattern Interferometry (ESPI) that provides a possibility to carry out such control in a fast, precise and non-contact manner and can be integrated directly in a production line. Analysing thermo-mechanical deformations of objects under study, the system is capable of identifying common defects in electronic modules, such as die attachment delamination.

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G. Laskin, H. Huai, M. Fratz, T. Seyler, T. Beckmann, A. Schiffmacher, A. Bertz, J. Wilde, and D. Carl "High-speed electronic speckle pattern interferometry for analysis of thermo-mechanical behavior of electronic components", Proc. SPIE 11782, Optical Measurement Systems for Industrial Inspection XII, 117820A (20 June 2021); https://doi.org/10.1117/12.2592024

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