Computational patterning and process variation impact on photonics devices

Maryvonne Chalony; Lawrence S. Melvin III; Rainer Zimmermann; Bernd Küchler; Emilie Viasnoff; Robert Scarmozzino; Daniel Herrmann; Yves Saad; Phil Stopford; Thuc Dam; Ulrich Klostermann; Wolfgang Demmerle; Al Blais; Remco Stoffer

doi:10.1117/12.2658788

1 May 2023 Computational patterning and process variation impact on photonics devices

Maryvonne Chalony, Lawrence S. Melvin III, Rainer Zimmermann, Bernd Küchler, Emilie Viasnoff, Robert Scarmozzino, Daniel Herrmann, Yves Saad, Phil Stopford, Thuc Dam, Ulrich Klostermann, Wolfgang Demmerle, Al Blais, Remco Stoffer

Author Affiliations +

Proceedings Volume 12499, Advanced Etch Technology and Process Integration for Nanopatterning XII; 124990A (2023) https://doi.org/10.1117/12.2658788
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Abstract

With the introduction of Augmented Reality, Virtual Reality, and Mixed Reality (AR/VR/MR) applications, the fabrication of photonics devices is approaching a high volume manufacturing level. To scale these products to consumer friendly dimensions, there is still significant shrink needed for many not yet available components such as ultrasmall cameras, metalenses, microdisplays, and combiner optics. AR/VR/MR optical components include metalenses patterned over large areas, and the fidelity of these patterns may have a significant impact on performance. In this study, we apply OPC to the design intent and examine the implication of various lithographic and correction techniques on metalens performance through simulation. In addition, we investigate the root causes of the manufacturing process variability and its impact on metalens functionality. These devices are analyzed by comparing light propagation through the simulated manufactured system using rigorous lithographic models to the optimal system based on the design intent. The study finds that the size and shape of meta-atoms have a different impact on optical performance, depending on the type of the metalens.

Conference Presentation

Citation Download Citation

Maryvonne Chalony, Lawrence S. Melvin III, Rainer Zimmermann, Bernd Küchler, Emilie Viasnoff, Robert Scarmozzino, Daniel Herrmann, Yves Saad, Phil Stopford, Thuc Dam, Ulrich Klostermann, Wolfgang Demmerle, Al Blais, and Remco Stoffer "Computational patterning and process variation impact on photonics devices", Proc. SPIE 12499, Advanced Etch Technology and Process Integration for Nanopatterning XII, 124990A (1 May 2023); https://doi.org/10.1117/12.2658788

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available