Presentation + Paper
21 November 2023 EUV single exposure tip-to-tip variability control through PEB process optimization in BEOL layers
Author Affiliations +
Abstract
This paper explores the effects of optimizing the post-exposure bake (PEB) process on controlling the variability of Tip-To-Tip (T2T) structures within metallization layers. To gauge variability control, we evaluated Local Critical Dimension Uniformity (LCDU) and Global Critical Dimension Uniformity (GCDU) during the After Development Inspection (ADI) phase. Each of the PEB process optimizations had a unique impact on both LCDU and GCDU. The combination of adjusting the PEB temperature and optimizing the PEB chamber environment produced the most favorable results. This led to a notable improvement of 18.4% in LCDU and 20.1% in GCDU, respectively.
Conference Presentation
(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Syamashree Roy, Elke Caron, Andreia Santos, Joern-Holger Franke, Jelle Vandereyken, and Sandip Halder "EUV single exposure tip-to-tip variability control through PEB process optimization in BEOL layers", Proc. SPIE 12750, International Conference on Extreme Ultraviolet Lithography 2023, 127500P (21 November 2023); https://doi.org/10.1117/12.2687558
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KEYWORDS
Process control

Critical dimension metrology

Back end of line

Extreme ultraviolet lithography

Optical lithography

Metals

Semiconducting wafers

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