Eutectic bonds on wafer scale by thin film multilayers

Carsten Christensen; Siebe Bouwstra

doi:10.1117/12.251228

23 September 1996 Eutectic bonds on wafer scale by thin film multilayers

Carsten Christensen, Siebe Bouwstra

Proceedings Volume 2879, Micromachining and Microfabrication Process Technology II; (1996) https://doi.org/10.1117/12.251228
Event: Micromachining and Microfabrication '96, 1996, Austin, TX, United States

Abstract

The use of gold based thin film multilayer systems for forming eutectic bonds on wafer scale is investigated and preliminary results will be presented. On polished 4 inch wafers different multilayer systems are developed using thin film techniques and bonded afterwards under reactive atmospheres and different bonding temperatures and forces. Pull tests are performed to extract the bonding strengths.

Citation Download Citation

Carsten Christensen and Siebe Bouwstra "Eutectic bonds on wafer scale by thin film multilayers", Proc. SPIE 2879, Micromachining and Microfabrication Process Technology II, (23 September 1996); https://doi.org/10.1117/12.251228

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