Characterization of 3D resist patterns by means of optical scatterometry

Joerg Bischoff; Lutz Hutschenreuther; Horst Truckenbrodt; A. Bauer; Ulrich Haak; T. Skaloud

doi:10.1117/12.346936

27 April 1999 Characterization of 3D resist patterns by means of optical scatterometry

Joerg Bischoff, Lutz Hutschenreuther, Horst Truckenbrodt, A. Bauer, Ulrich Haak, T. Skaloud

Proceedings Volume 3743, In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing; (1999) https://doi.org/10.1117/12.346936
Event: Microelectronic Manufacturing Technologies, 1999, Edinburgh, United Kingdom

Abstract

We report about our first attempts to apply optical scatterometry to the characterization of 3D resist patterns. Particularly, nominal quarter micron dots and holes are investigated having a pitch of a half micron in both directions. The specular reflected light versus the incidence angle shows significant variance with changing exposure dose and thus with changing dot or hole diameter, respectively. Scanning electron micrographs serve as an assisting tool for the characterization of the developed resist pattern. Additionally, an algorithm for the rigorous modeling of diffraction from regular 3D-patterns is sketched. In some cases, the match between experiment and theory is already quite satisfying. This might be improved by more refined profile adaption and enhanced computer power.

Citation Download Citation

Joerg Bischoff, Lutz Hutschenreuther, Horst Truckenbrodt, A. Bauer, Ulrich Haak, and T. Skaloud "Characterization of 3D resist patterns by means of optical scatterometry", Proc. SPIE 3743, In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing, (27 April 1999); https://doi.org/10.1117/12.346936

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