New method for the quantitative evaluation of wafer pattern shape based on CAD data

Ryoichi Matsuoka; Masanori Takahashi; Atsushi Uemoto

doi:10.1117/12.483688

2 June 2003 New method for the quantitative evaluation of wafer pattern shape based on CAD data

Ryoichi Matsuoka, Masanori Takahashi, Atsushi Uemoto

Proceedings Volume 5038, Metrology, Inspection, and Process Control for Microlithography XVII; (2003) https://doi.org/10.1117/12.483688
Event: Microlithography 2003, 2003, Santa Clara, California, United States

Abstract

Semiconductor device manufacturing demands rapid ramp of yield together with feature size reduction, especially for logic and ASIC because of their short-lives and small volume production characteristics. As a technological breakthrough for rapid yield ramp of such devices, we have endeavored to integrate CAD technology with SEM for printed pattern observation, and have developed Grade Scope, an evaluation technology, by combining the wafer proces and upstream design process.

Citation Download Citation

Ryoichi Matsuoka, Masanori Takahashi, and Atsushi Uemoto "New method for the quantitative evaluation of wafer pattern shape based on CAD data", Proc. SPIE 5038, Metrology, Inspection, and Process Control for Microlithography XVII, (2 June 2003); https://doi.org/10.1117/12.483688

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