Paper
24 January 2004 Packaging considerations for reliability of electrically controlled MEMS VOA
Yeong Gyu Lee, Seok Kee Hong, Moo Youn Park, Sung Cheon Jung, Seong Hun Lee
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Abstract
Unlike other Micro Electro Mechanical System (MEMS) type devices packaging, MEMS type optical devices require higher standard of packaging technique and careful material selection than any other MEMS type products. A number of attempts and a lot of efforts have been devoted to achieve a reliable MEMS type optical device. In this paper, we have achieved highly reliable MEMS type variable optical attenuator (VOA), which passed the Telcordia reliability standard for optical components, by our advanced packaging process and careful reliability considerations in the initial product design step. Our advanced packaging process includes, ultra fine optical fibre alignment on the MEMS chip, securing the aligned optical fibre and hermetic sealing technique. This paper will discuss above advanced packaging issues in detail and reliability test result of the device fabricated according to the developed packaging method.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yeong Gyu Lee, Seok Kee Hong, Moo Youn Park, Sung Cheon Jung, and Seong Hun Lee "Packaging considerations for reliability of electrically controlled MEMS VOA", Proc. SPIE 5346, MOEMS and Miniaturized Systems IV, (24 January 2004); https://doi.org/10.1117/12.524603
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CITATIONS
Cited by 4 scholarly publications.
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KEYWORDS
Microelectromechanical systems

Packaging

Reliability

Optical fibers

Epoxies

Actuators

Optical alignment

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