Paper
20 May 2006 Femtopulse laser-based mask repair in the DUV wavelength regime
Author Affiliations +
Abstract
Deep ultraviolet (DUV) femtosecond-pulsed laser ablation has numerous highly desirable properties for subtractive photomask defect repair. These qualities include high removal rates, resolution better than the focused spot size, minimized redeposition of the ablated material (rollup and splatter), and a negligible heat affected zone. The optical properties of the photomask result in a broad repair process window because the absorber film (whether Cr or MoSi) and the transmissive substrate allow for a high degree of material removal selectivity. Repair results and process parameters from such a system are examined in light of theoretical considerations. In addition, the practical aspects of the operation of this system in a production mask house environment are reviewed from the standpoint of repair quality, capability, availability, and throughput. Focus is given to the benefit received by the mask shop, and to the technical performance of the system.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Firoz Ghadiali, Vikram Tolani, Rajesh Nagpal, Tod Robinson, Jeff LeClaire, Ron Bozak, David A. Lee, and Roy White "Femtopulse laser-based mask repair in the DUV wavelength regime", Proc. SPIE 6283, Photomask and Next-Generation Lithography Mask Technology XIII, 628329 (20 May 2006); https://doi.org/10.1117/12.681779
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CITATIONS
Cited by 3 scholarly publications and 3 patents.
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KEYWORDS
Laser ablation

Deep ultraviolet

Electrons

Femtosecond phenomena

Photomasks

Chromium

Microscopes

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