Paper
20 October 2006 Correcting lithography hot spots during physical-design implementation
Gerard T. Luk-Pat, Alexander Miloslavsky, Atsuhiko Ikeuchi, Hiroaki Suzuki, Suigen Kyoh, Kyoko Izuha, Frank Tseng, Linni Wen
Author Affiliations +
Abstract
As the technology node shrinks, printed-wafer shapes show progressively less similarity to the design-layout shapes, even with optical proximity correction (OPC). Design tools have a restricted ability to address this shape infidelity. Their understanding of lithography effects is limited, taking the form of design rules that try to prevent "Hot Spots" - locations that demonstrate wafer-printing problems. These design rules are becoming increasingly complex and therefore less useful in addressing the lithography challenges. Therefore, design tools that have a better understanding of lithography are becoming a necessity for technology nodes of 65 nm and below. The general goal of this work is to correct lithography Hot Spots during physical-design implementation. The specific goal is to automatically fix a majority of the Hot Spots in the Metal 2 layers and above, with a run time on the order of a few hours per layer. Three steps were taken to achieve this goal. First, Hot Spot detection was made faster by using rule-based detection. Second, Hot Spot correction was automated by using rule-based correction. Third, convergence of corrections was avoided by performing correction locally, which means that correcting one Hot Spot was very unlikely to create new Hot Spots.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gerard T. Luk-Pat, Alexander Miloslavsky, Atsuhiko Ikeuchi, Hiroaki Suzuki, Suigen Kyoh, Kyoko Izuha, Frank Tseng, and Linni Wen "Correcting lithography hot spots during physical-design implementation", Proc. SPIE 6349, Photomask Technology 2006, 634920 (20 October 2006); https://doi.org/10.1117/12.692865
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CITATIONS
Cited by 6 scholarly publications and 12 patents.
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KEYWORDS
Model-based design

Lithography

Optical proximity correction

Metals

Resolution enhancement technologies

Astatine

Data modeling

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