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With the introduction of 450 mm wafers, which are considerably larger than the currently largest wafers of 300mm,
handling with side grippers is no longer possible and backside grippers are required. Backside gripping increases the
possible buildup of particles on the backside of the wafers with possible cross-contamination to the front-side. Therefore,
regular backside cleaning is required. Three vacuum compatible cleaning methods were selected. Tacky rollers and highvoltage
cleaning were selected for particles and plasma cleaning for molecular layers. A test-bench was designed and
constructed implementing these three cleaning methods. The first experiments show promising results for the plasma
cleaner and the tacky roller.
A. J. de Jong,J. C. J. van der Donck,T. Huijser,O. Kievit,R. Koops,N. B. Koster,F. T. Molkenboer, andA. M. M. G. Theulings
"Contamination control: removing small particles from increasingly large wafers", Proc. SPIE 8324, Metrology, Inspection, and Process Control for Microlithography XXVI, 832423 (3 April 2012); https://doi.org/10.1117/12.916366
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A. J. de Jong, J. C. J. van der Donck, T. Huijser, O. Kievit, R. Koops, N. B. Koster, F. T. Molkenboer, A. M. M. G. Theulings, "Contamination control: removing small particles from increasingly large wafers," Proc. SPIE 8324, Metrology, Inspection, and Process Control for Microlithography XXVI, 832423 (3 April 2012); https://doi.org/10.1117/12.916366