Laser thin film ablation with multiple beams and tailored beam profiles

Stefan Rung; Christian Bischoff; Erwin Jäger; Udo Umhofer; Ralf Hellmann

doi:10.1117/12.2038572

6 March 2014 Laser thin film ablation with multiple beams and tailored beam profiles

Stefan Rung, Christian Bischoff, Erwin Jäger, Udo Umhofer, Ralf Hellmann

Proceedings Volume 8967, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XIX; 89670P (2014) https://doi.org/10.1117/12.2038572
Event: SPIE LASE, 2014, San Francisco, California, United States

Abstract

For thin film ablation one can often not take full advantage of the relatively high output power and high pulse energy of lasers. A solution might be the use of parallel processing technique with multiple beams which help to increase process speed and to save process costs. Within this contribution we demonstrate thin film scribing of GZO and ITO which shows the potential of parallel processing combined with Top-hat beam shaping. The beam shaping optic provides process optimized beam profiles leading to a more efficient process and an improved ablation quality.

Citation Download Citation

Stefan Rung, Christian Bischoff, Erwin Jäger, Udo Umhofer, and Ralf Hellmann "Laser thin film ablation with multiple beams and tailored beam profiles", Proc. SPIE 8967, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XIX, 89670P (6 March 2014); https://doi.org/10.1117/12.2038572

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