Ms. Alison Gracias Profile

Alison Gracias

at ASML

SPIE Involvement:

Author

Publications (11)

Proceedings Article | 19 February 2009 Paper

SU-8 microfluidic channels with porous sidewalls for biological applications

Michael Padgen, Alison Gracias, Natalya Tokranova, Nathaniel Cady, James Castracane

Proceedings Volume 7207, 720707 (2009) https://doi.org/10.1117/12.807665

KEYWORDS: Microfluidics, Semiconducting wafers, Photomicroscopy, Polymers, Plasma, Photoresist materials, Silicon, Proteins, Scanning electron microscopy, BioMEMS

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Proceedings Article | 7 February 2009 Paper

A novel optical component for the development of an integrated interferometric system

A. Gracias, N. Tokranova, S. Olson, J. Castracane

Proceedings Volume 7212, 72120P (2009) https://doi.org/10.1117/12.808043

KEYWORDS: Optical components, Mirrors, Vertical cavity surface emitting lasers, Polyurethane, Beam splitters, Sensors, Interferometry, Integrated optics, Polymers, System integration

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SPIE Journal Paper | 1 April 2008

New approaches for chip-to-chip interconnects: integrating porous silicon with MOEMS

Da Song, Natalya Tokranova, Alison Gracias, James Castracane

JM3, Vol. 7, Issue 02, 021013, (April 2008) https://doi.org/10.1117/12.10.1117/1.2909279

KEYWORDS: Diffractive optical elements, Silicon, Actuators, Mirrors, Multilayers, Optical components, Scanning electron microscopy, Diffraction, Microopto electromechanical systems, Electrochemical etching

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Proceedings Article | 9 February 2008 Paper

A porous silicon thermally tunable optical filter

Da Song, Natalya Tokranova, Alison Gracias, James Castracane

Proceedings Volume 6887, 68870C (2008) https://doi.org/10.1117/12.759165

KEYWORDS: Actuators, Silicon, Optical filters, Reflectivity, Microopto electromechanical systems, Electrochemical etching, Optical components, Etching, Semiconducting wafers, Refractive index

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Proceedings Article | 8 February 2008 Paper

SU8-based static diffractive optical elements: wafer-level integration with VCSEL arrays

A. Gracias, N. Tokranova, J. Castracane

Proceedings Volume 6899, 68990J (2008) https://doi.org/10.1117/12.760400

KEYWORDS: Vertical cavity surface emitting lasers, Diffraction gratings, Diffraction, Diffractive optical elements, Optical interconnects, Glasses, Optical components, Integrated optics, Wafer-level optics, Silicon

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With the continued miniaturization and sophistication of current generations of semiconductor devices, it is the limitations of data transfer rates that are beginning to impact system performance. Although conventional pathways continue progressing, researchers are moving toward optical interconnects as a potential solution. Optical interconnection is a promising way to replace existing global or chip-to-chip interconnects in future integrated circuits. In contrast to existing metallic wiring, optical interconnects exhibit smaller distance-related loss or distortion of the signal, no deleterious fringing effects and no heat dissipation in the interconnect itself. Pioneering interconnect schemes are currently being developed using both planar waveguides and fibers to distribute optical signals around printed circuit boards. However, researchers are now attempting to incorporate novel, freespace optical interconnects, which will boost data transfer rates by a factor of a thousand. These systems consist of a number of components including vertical cavity surface emitting lasers (VCSELs), lenses, diffractive optical elements and detectors. Integration of single components into sub-systems will help to minimize the optical system footprint for both on-chip and chip-to-chip interconnects. This paper will present the development of both independent and integrated with VCSELs,static diffractive optical element (DOEs) made of SU8 and prove the feasibility of such an approach. SU8 is a negative tone photoresist, conventionally used for high aspect ratio MEMS-based structures. Recent developments in thin film SU8 along with its low absorption at long wavelengths makes it a suitable material for optical applications. By developing a low cost lithography based process, SU-8 DOEs can be efficiently integrated directly on laser sources with minimal effect to VCSEL performance. This approach could have a significant impact on the creation of next generation optical I/O fabrics.

Proceedings Article | 6 February 2007 Paper

Porous silicon 2D photonic crystals

Natalya Tokranova, Da Song, Alison Gracias, James Castracane

Proceedings Volume 6480, 64800T (2007) https://doi.org/10.1117/12.699127

KEYWORDS: Silicon, Photonic crystals, Photoresist materials, Photomasks, Diffraction, Etching, Refractive index, Silicon photonics, Optical components, Optical properties

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SPIE Journal Paper | 1 April 2006

Novel microfabrication approach of embedded SU8^TM fluidic networks for cell transport on chips

Alison Gracias, Xiaojun Feng, Bai Xu, James Castracane

JM3, Vol. 5, Issue 02, 021102, (April 2006) https://doi.org/10.1117/12.10.1117/1.2200674

KEYWORDS: Ultraviolet radiation, Fourier transforms, Microfabrication, Microfluidics, Silicon, Biosensors, Wafer bonding, Semiconducting wafers, Roads, Polymers

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Proceedings Article | 10 February 2006 Paper

Novel spatially distributed porous Si optical bandpass filters

N. Tokranova, I. Levitsky, A. Gracias, B. Xu, J. Castracane

Proceedings Volume 6128, 612806 (2006) https://doi.org/10.1117/12.640871

KEYWORDS: Silicon, Electrodes, Optical filters, Aluminum, Semiconducting wafers, Reflectivity, Bandpass filters, Optical microcavities, Refractive index, Interference filters

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Proceedings Article | 6 January 2006 Paper

Wafer bonding for 3D integration of MEMS/CMOS

Alison Gracias, James Castracane, Bai Xu

Proceedings Volume 6111, 61110O (2006) https://doi.org/10.1117/12.646467

KEYWORDS: Semiconducting wafers, Wafer bonding, Microelectromechanical systems, Silicon, System on a chip, Polymers, Interfaces, CMOS technology, Standards development, Sensors

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Proceedings Article | 22 January 2005 Paper

Microfabricated devices for bio-applications

Xiaojun Feng, Ben Szaro, Alison Gracias, Sofie Baselmans, Natalya Tokranova, Bai Xu, James Castracane

Proceedings Volume 5718, (2005) https://doi.org/10.1117/12.591618

KEYWORDS: Fourier transforms, Silicon, Prototyping, Electrodes, Microfabrication, Acquisition tracking and pointing, Microfluidics, Silicon films, Lab on a chip, Calcium

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Proceedings Article | 23 December 2003 Paper

Reliability study of wafer bonding for micro-electro-mechanical systems

Mahmoud Almasri, Bruce Altemus, Alison Gracias, Larry Clow, Natalya Tokranova, James Castracane, Bai Xu

Proceedings Volume 5343, (2003) https://doi.org/10.1117/12.524934

KEYWORDS: Semiconducting wafers, Wafer bonding, Interfaces, Silicon, Microelectromechanical systems, Temperature metrology, Reliability, System on a chip, Polymers, Scanning electron microscopy

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Showing 5 of 11 publications

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