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Arne Quellmalz
at KTH Royal Institute of Technology
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Publications (1)
Proceedings Article | 5 March 2022 Presentation + Paper
Wafer-scale integration of layered 2D materials by adhesive wafer bonding
Arne Quellmalz, Simon Sawallich, Maximilian Prechtl, Oliver Hartwig, Georg Duesberg, Max Lemme, Frank Niklaus, Kristinn Gylfason
Proceedings Volume 12003, 1200304 (2022) https://doi.org/10.1117/12.2605116
KEYWORDS: Graphene, Semiconducting wafers, Adhesives, Molybdenum, Heterojunctions, Wafer bonding, Chemical vapor deposition, Silicon, Raman spectroscopy, Resistance, Optoelectronics integration, Very large scale integration
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