Erin S. Wernick
at HRL Labs LLC
SPIE Involvement:
Author
Publications (1)

Proceedings Article | 17 March 2023 Presentation
Proceedings Volume PC12433, PC124330H (2023) https://doi.org/10.1117/12.2648588
KEYWORDS: Ceramics, Packaging, Sensors, Additive manufacturing, Readout integrated circuits, Standards development, Semiconductors, Printing, Microelectronics, Lithography

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