Dr. Jack Martin Profile

Dr. Jack Martin

Senior Development Engineer at Analog Devices Inc

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Publications (2)

Proceedings Article | 19 January 2007 Paper

Wafer capping of MEMS with fab-friendly metals

Jack Martin

Proceedings Volume 6463, 64630M (2007) https://doi.org/10.1117/12.701573

KEYWORDS: Semiconducting wafers, Wafer bonding, Glasses, Metals, Microelectromechanical systems, Aluminum, Sensors, Silicon, Packaging, Reliability

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Proceedings Article | 21 November 2001 Paper

Three-terminal test structure to measure stiction force using I-V data

Enakshi Bhattacharya, Jinbo Kuang, Michael Judy, Jack Martin

Proceedings Volume 4592, (2001) https://doi.org/10.1117/12.448974

KEYWORDS: Actuators, Semiconducting wafers, Microelectromechanical systems, Scanning electron microscopy, Finite element methods, Visualization, Packaging, Analog electronics, Wafer-level optics, Calibration

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