Dr. Jacob Ofek Profile

Dr. Jacob Ofek

at Nova Measuring Instruments Inc.

SPIE Involvement:

Author

Publications (6)

Proceedings Article | 10 April 2024 Presentation + Paper

Spectral interferometry for TSV metrology in chiplet technology

Stefan Schoeche, Daniel Schmidt, Junwon Han, Shahid Butt, Katherine Sieg, Marjorie Cheng, Aron Cepler, Shaked Dror, Jacob Ofek, Ilya Osherov, Igor Turovets

Proceedings Volume 12955, 129551O (2024) https://doi.org/10.1117/12.3011748

KEYWORDS: Semiconducting wafers, Wafer level optics, Metrology, Silicon, Reactive ion etching, Reflection, Interferometry, Dielectrics, Polarization, Semiconductor manufacturing

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Proceedings Article | 10 April 2024 Presentation + Paper

Unique spectral interferometry solutions for complex high aspect ratio 3D NAND structures

Jaesuk Yoon, Jongmin Park, Minjung Shin, Dongchul Ihm, Oshrat Bismuth, Smadar Ferber, Jacob Ofek, Igor Turovets, Isaac Kim

Proceedings Volume 12955, 129551S (2024) https://doi.org/10.1117/12.3010729

KEYWORDS: Semiconducting wafers, 3D metrology, Silicon, Chemical mechanical planarization, Interferometry, Modeling, Scatterometry, Metrology

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SPIE Journal Paper | 21 February 2023 Open Access

Spectral interferometry for fully integrated device metrology

Daniel Schmidt, Manasa Medikonda, Michael Rizzolo, Claire Silvestre, Julien Frougier, Andrew Greene, Mary Breton, Aron Cepler, Jacob Ofek, Itzik Kaplan, Roy Koret, Igor Turovets

JM3, Vol. 22, Issue 03, 031203, (February 2023) https://doi.org/10.1117/12.10.1117/1.JMM.22.3.031203

KEYWORDS: Metrology, Interferometry, Data modeling, Tunable filters, Semiconducting wafers, Scatterometry, Optical filters, Machine learning, Education and training, Dielectrics

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Proceedings Article | 26 May 2022 Presentation + Paper

Vertical travelling scatterometry for metrology on fully integrated devices

D. Schmidt, M. Medikonda, M. Rizzolo, C. Silvestre, J. Frougier, A. Greene, M. Breton, A. Cepler, J. Ofek, I. Kaplan, R. Koret, I. Turovets

Proceedings Volume 12053, 120530S (2022) https://doi.org/10.1117/12.2614077

KEYWORDS: Metrology, Semiconducting wafers, Scatterometry, Optical filters, Dielectrics, Data modeling, Back end of line, Front end of line, Chemical mechanical planarization, Transmission electron microscopy

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SPIE Journal Paper | 27 January 2022 Open Access

In-line Raman spectroscopy for gate-all-around nanosheet device manufacturing

Daniel Schmidt, Curtis Durfee, Juntao Li, Nicolas Loubet, Aron Cepler, Lior Neeman, Noga Meir, Jacob Ofek, Yonatan Oren, Daniel Fishman

JM3, Vol. 21, Issue 02, 021203, (January 2022) https://doi.org/10.1117/12.10.1117/1.JMM.21.2.021203

KEYWORDS: Silicon, Germanium, Raman spectroscopy, Optical lithography, Manufacturing, Semiconducting wafers, Polarization, Metrology, Raman scattering, Phonons

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Proceedings Article | 25 February 2021 Presentation + Paper

In-line Raman spectroscopy for stacked nanosheet device manufacturing

D. Schmidt, C. Durfee, J. Li, N. Loubet, A. Cepler, L. Neeman, N. Meir, J. Ofek, Y. Oren, D. Fishman

Proceedings Volume 11611, 116111T (2021) https://doi.org/10.1117/12.2582181

KEYWORDS: Raman spectroscopy, Manufacturing, Metrology, Optical lithography, X-ray diffraction, Silicon, Nondestructive evaluation, Germanium, Diffraction, Transistors

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Showing 5 of 6 publications

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