Dr. Kaiying Wang Profile

Dr. Kaiying Wang

at Univ College of Southeast Norway

SPIE Involvement:

Author

Publications (6)

SPIE Journal Paper | 1 December 2011

Electroactive polymer-based spatial light modulator with high reliability and fast response speed

Guangmin Ouyang, Kaiying Wang, Xuyuan Chen, Lars Henriksen

OE, Vol. 50, Issue 12, 124001, (December 2011) https://doi.org/10.1117/12.10.1117/1.3659216

KEYWORDS: Spatial light modulators, Electroactive polymers, Electrodes, Polymers, Reliability, Modulation, Prisms, Far-field diffraction, Microopto electromechanical systems, Manufacturing

Read Abstract +

Proceedings Article | 14 September 2010 Paper

Simulation of laser speckle reduction by using an array of diffraction gratings

Z. Tong, G. Ouyang, W. Gao, M. Akram, V. Kartashov, K. Wang, X. Chen

Proceedings Volume 7387, 73871S (2010) https://doi.org/10.1117/12.868999

KEYWORDS: Diffraction gratings, Speckle, Diffraction, Speckle pattern, Zemax, Prisms, Optical simulations, Chromium, Sensors, Light scattering

Read Abstract +

Proceedings Article | 14 September 2010 Paper

Polymer-based multiple diffraction modulator for speckle reduction

G. Ouyang, Z. Tong, W. Gao, K. Wang, M. Akram, V. Kartashov, X. Chen

Proceedings Volume 7387, 73871F (2010) https://doi.org/10.1117/12.869886

KEYWORDS: Modulators, Polymers, Diffraction, Speckle, Diffraction gratings, Speckle pattern, Electrodes, Diffusers, Sensors, Gold

Read Abstract +

Proceedings Article | 14 May 2010 Paper

Low-cost uncooled microbolometers for thermal imaging

Niclas Roxhed, Frank Niklaus, Andreas Fischer, Fredrik Forsberg, Linda Höglund, Per Ericsson, Björn Samel, Stanley Wissmar, Anders Elfving, Tor Ivar Simonsen, Kaiying Wang, Nils Hoivik

Proceedings Volume 7726, 772611 (2010) https://doi.org/10.1117/12.855752

KEYWORDS: Bolometers, Semiconducting wafers, Wafer bonding, Germanium, Tin, Infrared bolometers, Copper, Readout integrated circuits, Microelectromechanical systems, Quantum wells

Read Abstract +

Cost efficient integration technologies and materials for manufacturing of uncooled infrared bolometer focal plane arrays (FPA) are presented. The technology platform enables 320x240 pixel resolution with a pitch down to 20 μm and very low NETD. A heterogeneous 3D MEMS integration technology called SOIC (Silicon-On-Integrated-Circuit) is used to combine high performance Si/SiGe bolometers with state-of-the-art electronic read-out-integrated-circuits. The SOIC integration process consists of: (a) Separate fabrication of the CMOS wafer and the MEMS wafer. (b) Adhesive wafer bonding. (c) Sacrificial removal of the MEMS handle wafer. (d) Via-hole etching. (e) Via formation and MEMS device definition. (f) Sacrificial etching of the polymer adhesive. We will present an optimized process flow that only contains dry etch processes for the critical process steps. Thus, extremely small, sub-micrometer feature sizes and vias can be implemented for the infrared bolometer arrays. The Si/SiGe thermistor is grown epitaxially, forming a mono-crystalline multi layer structure. The temperature coefficient of resistance (TCR) is primarily controlled by the concentration of Ge present in the strained SiGe layers. TCR values of more than 3%/K can be achieved with a low signal-to-noise ratio due to the mono-crystalline nature of the material. In addition to its excellent electrical properties, the thermistor material is thermally stable up to temperatures above 600 °C, thus enabling the novel integration and packaging techniques described in this paper. Vacuum sealing at the wafer level reduces the overall costs compared to encapsulation after die singulation. Wafer bonding is performed using a Cu-Sn based metallic bonding process followed by getter activation at ≥350 °C achieving a pressure in the 0.001 mbar range. After assembling, the final metal phases are stable and fully compatible with hightemperature processes. Hermeticity over the product lifetime is accomplished by well-controlled electro-deposition of metal layers, optimized bonding parameters and a suitable bond frame design.

Proceedings Article | 24 August 2009 Paper

Surface and electromechanical properties of polydimethylsiloxane films prepared by a modified molding technique

Kaiying Wang, Guangming Ouyang, Lars Henriksen, Muhammad Akram, Xuyuan Chen

Proceedings Volume 7381, 73810C (2009) https://doi.org/10.1117/12.835460

KEYWORDS: Polymers, Electrodes, Modulators, Silicon, Gold, Thin films, Silicon films, Semiconducting wafers, Scanning electron microscopy, Dielectrics

Read Abstract +

Proceedings Article | 22 August 2009 Paper

Fabrication and characterization of polymer based spatial light modulators

G. Ouyang, K. Wang, M. Akram, X. Chen

Proceedings Volume 7426, 742604 (2009) https://doi.org/10.1117/12.825507

KEYWORDS: Spatial light modulators, Gold, Electrodes, Polymers, Coating, Glasses, Reflectivity, Modulators, Diffraction, Time metrology

Read Abstract +

Showing 5 of 6 publications

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Keywords/Phrases

Search In:

Publication Years