Mr. Richard Collett Profile

Richard Collett

VP, Technology Development

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Author

Publications (4)

Proceedings Article | 31 March 2010 Paper

Process optimization consideration for 193nm developable bottom anti-reflective coatings (DBARCs)

Takanori Kudo, Srinivasan Chakrapani, Alberto Dioses, Edward Ng, Charito Antonio, Deepa Parthasarathy, Richard Collett, Mark Neisser, Munirathna Padmanaban

Proceedings Volume 7639, 763928 (2010) https://doi.org/10.1117/12.846313

KEYWORDS: Fourier transforms, Lithography, Silicon, Plasma etching, Plasma, Coating, Polymers, Bottom antireflective coatings, Etching, 193nm lithography

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Proceedings Article | 11 December 2009 Paper

Latest developments in photosensitive developable bottom anti-reflective coating (DBARC)

Takanori Kudo, Srinivasan Chakrapani, Alberto Dioses, Edward Ng, Charito Antonio, Deepa Parthasarathy, Shinji Miyazaki, Yuki Ubayashi, Kazuma Yamamoto, Yasushi Akiyama, Richard Collett, Mark Neisser, Munirathna Padmanaban

Proceedings Volume 7520, 75200N (2009) https://doi.org/10.1117/12.837050

KEYWORDS: Fourier transforms, Polymers, Lithography, Bottom antireflective coatings, Plasma etching, Plasma, Etching, Silicon, Semiconducting wafers, Scanning electron microscopy

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Proceedings Article | 1 April 2009 Paper

Double imaging with resist freezing in a vapor reaction chamber

Ralph Dammel, Yusuke Takano, Richard Collett, David Abdallah

Proceedings Volume 7273, 72731F (2009) https://doi.org/10.1117/12.815138

KEYWORDS: Semiconducting wafers, Electronic design automation, Image processing, FT-IR spectroscopy, Photoresist processing, Double patterning technology, Fourier transforms, Nitrogen, Photoresist materials, Head-mounted displays

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Proceedings Article | 4 December 2008 Paper

Spin-on trilayer scheme: enabling materials for extension of ArF immersion lithography to 32nm node and beyond

Ruzhi Zhang, Allen Timko, Lyudmila Pylneva, Jennifer Loch, Hengpeng Wu, David Abdallah, Richard Collett, Yayi Wei, Dalil Rahman, Douglas McKenzie, Ping-Hung Lu, Mark Neisser

Proceedings Volume 7140, 71402T (2008) https://doi.org/10.1117/12.804748

KEYWORDS: Silicon, Etching, Reflectivity, Semiconducting wafers, Polymers, Lithography, Photoresist materials, Immersion lithography, Coating, Fourier transforms

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