A critical challenge in semiconductor manufacturing is the high electricity consumption, especially by lithography tools, which significantly contribute to the industry's environmental impact. For lithography track systems, reducing the energy consumption of hotplate processes is essential due to their high energy demands. This study introduces an innovative, energy-efficient process that offers a viable alternative to conventional thermal crosslinking systems for Spin-On Carbon (SOC) and spin-on glass (SOG) underlayers, which typically require high temperatures for full film densification. The proposed method utilizes an overall-wafer optical exposure system, integrated on SCREEN’s DT-3000 track, to crosslink underlayer materials designed by Brewer Science to cure through light exposure. This paper demonstrates how this optical crosslinking approach can achieve substantial energy savings of 85% for SOC and 60% for SOG, while maintaining lithographic performance. The transition from a traditional hotplate process to a light-curing mechanism is thoroughly examined from multiple perspectives.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.