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Dr. Ximan Jiang
at PIE Scientific LLC
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Publications (1)
Proceedings Article | 18 April 2013 Paper
Capturing buried defects in metal interconnections with electron beam inspection system
Hong Xiao, Ximan Jiang, David Trease, Mike Van Riet, Shishir Ramprasad, Anadi Bhatia, Pierre Lefebvre, David Bastard, Olivier Moreau, Chris Maher, Paul MacDonald, Cecelia Campochiaro
Proceedings Volume 8681, 86810F (2013) https://doi.org/10.1117/12.2011162
KEYWORDS: Copper, Metals, Scanning electron microscopy, Semiconducting wafers, Monte Carlo methods, Tungsten, Virtual colonoscopy, Transmission electron microscopy, Inspection, Chemical mechanical planarization
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