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Yongfeng Fu
at GLOBALFOUNDRIES Singapore
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Publications (1)
Proceedings Article | 4 March 2010 Paper
A novel method to reduce wafer topography effect for implant lithography process
Lei Yuan, Sanggil Bae, Yong Feng Fu, Ao Chen, Hui Peng Koh, Qun Ying Lin
Proceedings Volume 7640, 76403E (2010) https://doi.org/10.1117/12.846002
KEYWORDS: Semiconducting wafers, Lithography, Critical dimension metrology, Reflection, Photomasks, Diffraction, Bottom antireflective coatings, Wafer-level optics, Photoresist processing, Optical lithography
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