Mechanical properties of LEDs bonds realized with conductive adhesives paste

Mihai Branzei; Marian Vladescu; Ioan Plotog; Gaudentiu Varzaru; Bogdan Mihailescu

doi:10.1117/12.2326206

31 December 2018 Mechanical properties of LEDs bonds realized with conductive adhesives paste

Mihai Branzei, Marian Vladescu, Ioan Plotog, Gaudentiu Varzaru, Bogdan Mihailescu

Proceedings Volume 10977, Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies IX; 109770I (2018) https://doi.org/10.1117/12.2326206
Event: Advanced Topics in Optoelectronics, Microelectronics and Nanotechnologies IX, 2018, Constanta, Romania

Abstract

The SW150 and the new types SW180 of Electrically Conductive Adhesives (ECA) dedicated to printing circuits¹, meeting RoHS EU Directive², were used, according to REACH EU Regulation³, to bond optoelectronics components, LED type, on test printed circuit boards (TPCBs) having daisy chain interconnection structures. Mechanical properties of LEDs bonds function of temperatures by measuring shear forces applied on each of bonded LEDs maintaining TPCBs at different temperature from ambient to 398 K (125°C), were investigated. The shear forces measured values, the LEDs bonds micro sections and the microfractography after shear testes analyses and interpretations, facilitate the construction of a database that provides support for the development of temperature-sensitive optoelectronic device assembling solutions by bonding, using ECA. These solutions ensure avoidance of their functional temperature failures during classical assembly processes, comparing ECA curing and reflow temperatures.

Citation Download Citation

Mihai Branzei, Marian Vladescu, Ioan Plotog, Gaudentiu Varzaru, and Bogdan Mihailescu "Mechanical properties of LEDs bonds realized with conductive adhesives paste", Proc. SPIE 10977, Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies IX, 109770I (31 December 2018); https://doi.org/10.1117/12.2326206

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