Presentation + Paper
28 April 2023 Expected performance of digital scanner and the potential application for advanced semiconductor fabrication
Author Affiliations +
Abstract
The first planned Digital Scanner product, DS248, will have the optical resolution of 110 nm and overlay accuracy of less than 10 nm, the same level as a KrF mask scanner. In addition, DS248 has more application areas, such as individual chip customization and large-area printing up to wafer size, with KrF resolution, which are not possible with the current mask scanner but will be beneficial for performance enhancement of semiconductor devices in future. The latest exposure results of DS-POC, which has the similar imaging performance with DS248, are introduced including chip ID exposure on entire 200 mm wafer and exposure of wafer scale integration substrate. Simulation data of high aspect ratio patterning with high resolution by means of integration of multiple heads of solid-state laser is described. Development progress of DS’s pixel mask conversion software that directly generates pixel mask from target pattern with OPC is reported.
Conference Presentation
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yoji Watanabe, Yuho Kanaya, Yusuke Saito, Toshiaki Sakamoto, Kazuo Masaki, Soichi Owa, Thomas Koo, Bryant Lin, Michael Tan, David Tseng, Conrad Sorensen, Sujuan Li, Stephen Renwick, Noriyuki Hirayanagi, and Bausan Yuan "Expected performance of digital scanner and the potential application for advanced semiconductor fabrication", Proc. SPIE 12494, Optical and EUV Nanolithography XXXVI, 124940A (28 April 2023); https://doi.org/10.1117/12.2657730
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Semiconducting wafers

Scanners

Optical proximity correction

Laser scanners

Optical lithography

Printing

Semiconductors

RELATED CONTENT


Back to Top