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As semiconductor device scaling continues to challenge lithographic capabilities, complex corrections such as those offered by inverse lithography technology (ILT) have become essential. The MULTIGON record, developed to utilize Bezier curves for efficiently representing curved mask patterns through ILT, has been incorporated into the SEMI P49 extension of the OASIS format. Over time, as the standard format has been established, EDA vendors and mask manufacturing equipment makers have progressively implemented these specifications, enabling them to evaluate using various real-world data. Our earlier study has not only addressed the handling of Bezier curves in Mask Data Preparation (MDP) but have also raised and discussed fundamental issues regarding the necessary geometric operations for MDP, exploring potential problems that might arise. This paper evaluates their practical application in mask layouts, specifically focusing on the challenges associated with implicit Bezier curve representations and the sizing operation to implicit Bezier curves, which is very essential geometric operations for MDP.
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