Paper
17 May 1994 Aerial image measurements on a commercial stepper
Charles H. Fields, William N. Partlo, William G. Oldham
Author Affiliations +
Abstract
A new method of testing high numerical aperture microlithographic lenses involves measuring the aerial image produced by the lens rather than using developed resist profiles. Direct measurement of the aerial image eliminates any process variations associated with the resist processing and also removes the subjective nature of evaluating resist profiles. The means of characterizing the aerial image is to measure the image intensity from grating patterns positioned at the image plane. Our image monitor used an artifact mask cover with 2-D scanning pinholes placed over a photodetector. This pinhole cover was fabricated in an 800 angstrom thick layer of amorphous silicon. The size of the pinholes is 0.2 micrometers and the pitch of the pinholes is 6.0 micrometers . This system of Aerial Image Measurement (AIM) has been successfully implemented on a 0.53 NA, deep-UV (DUV) microlithography stepper. In this paper we present the results of various direct aerial images such as elbows, contacts and isolated lines and space patterns measured with this technique. These images are produced from conventional chrome DUV masks.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Charles H. Fields, William N. Partlo, and William G. Oldham "Aerial image measurements on a commercial stepper", Proc. SPIE 2197, Optical/Laser Microlithography VII, (17 May 1994); https://doi.org/10.1117/12.175453
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CITATIONS
Cited by 3 scholarly publications.
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KEYWORDS
Sensors

Image sensors

Deep ultraviolet

Image processing

Monochromatic aberrations

Scanning electron microscopy

Amorphous silicon

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