Patterning fidelity on low-energy multiple-electron-beam direct write lithography

S. M. Chang; S. J. Lin; C. A. Lin; J. H. Chen; T. S. Gau; Burn J. Lin; P. Veltman; R. Hanfoug; E. Slot; M. J. Wieland; B. J. Kampherbeek

doi:10.1117/12.771392

20 March 2008 Patterning fidelity on low-energy multiple-electron-beam direct write lithography

S. M. Chang, S. J. Lin, C. A. Lin, J. H. Chen, T. S. Gau, Burn J. Lin, P. Veltman, R. Hanfoug, E. Slot, M. J. Wieland, B. J. Kampherbeek

Author Affiliations +

Proceedings Volume 6921, Emerging Lithographic Technologies XII; 69211R (2008) https://doi.org/10.1117/12.771392
Event: SPIE Advanced Lithography, 2008, San Jose, California, United States

Abstract

The Multiple E-beam Direct Write (MEBDW) technology has been considered a promising solution for the next generation lithography to delineate 32-nm half-pitch and beyond. A low-energy, say 5 keV, e-beam direct writing system has advantages in lower exposure dosage, less heating effect on resist, and less damage to devices underneath, comparing with a high energy one, such as 50 keV or 100 keV. However, the low-energy electron-beam is easily blurred due to forward scattering in the substrate due to its shallow penetration and hence loses resolution. In this paper, variables affecting patterning fidelity of a raster-scan MEBDW system are investigated. In order to realize a MEBDW system with acceptable throughput, a relatively large beam size is chosen for sufficient beam current to sustain throughput while maintaining enough resolution. The imaging resolution loss and the proximity effect, due to beam blurring through the resist, have been observed. The in-house software MOSES, incorporating the Monte Carlo simulation and the Double Gaussian model was used to evaluate 1-D and 2-D pattern fidelity with various exposure conditions. The line width roughness, which represents 1-D fidelity, was evaluated on 32-nm dense lines. Pattern fidelity of 2-D features such as the zigzag poly line and dense metal patterns was also examined. The impact to LWR of using the edge dithering method, instead of dosage modulation, to control the line width accuracy beyond the pixel size was studied.

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S. M. Chang, S. J. Lin, C. A. Lin, J. H. Chen, T. S. Gau, Burn J. Lin, P. Veltman, R. Hanfoug, E. Slot, M. J. Wieland, and B. J. Kampherbeek "Patterning fidelity on low-energy multiple-electron-beam direct write lithography", Proc. SPIE 6921, Emerging Lithographic Technologies XII, 69211R (20 March 2008); https://doi.org/10.1117/12.771392

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