Paper
21 March 2008 Evaluation result of Selete's exposure tool: impact of the source performance
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Abstract
We have installed a small-field exposure tool (SFET) manufactured by Canon and EUVA with a discharge-producedplasma EUV source that employs Xenon gas. We investigated how the performance of the source affects lithographic performance. Electrode life has relation to the illumination uniformity of the exposure field on wafer surface. Also source power at the wafer surface has relation to the electrode life. Electrode life makes EUV power decreasing and larger illumination uniformity number. We examine the pupilgram test using high sensitivity resist. Actual pupil fill shape was observed and there was non-uniform distribution. Pupil fill shape was changed after exchanging electrode, also resist CD bias between parallel and horizontal line of the field. That was comparable to the simulation result. The source electrode requires periodic replacement, which impacts not only the performance of the source, but also the lithographic performance of the tool, such as the CD of resist patterns.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kazuo Tawarayama, Shunko Magoshi, Hajime Aoyama, Yuusuke Tanaka, Seiichiro Shirai, and Hiroyuki Tanaka "Evaluation result of Selete's exposure tool: impact of the source performance", Proc. SPIE 6921, Emerging Lithographic Technologies XII, 69212V (21 March 2008); https://doi.org/10.1117/12.771891
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Cited by 6 scholarly publications.
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KEYWORDS
Electrodes

Extreme ultraviolet

Semiconducting wafers

Lithography

Plasma

Extreme ultraviolet lithography

Mirrors

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