Die-to-database mask inspection with variable sensitivity

Hideo Tsuchiya; Masakazu Tokita; Takehiko Nomura; Tadao Inoue

doi:10.1117/12.793088

19 May 2008 Die-to-database mask inspection with variable sensitivity

Hideo Tsuchiya, Masakazu Tokita, Takehiko Nomura, Tadao Inoue

Proceedings Volume 7028, Photomask and Next-Generation Lithography Mask Technology XV; 70282I (2008) https://doi.org/10.1117/12.793088
Event: Photomask and NGL Mask Technology XV, 2008, Yokohama, Japan

Abstract

The cost of mask is increasing dramatically along with the continuous semiconductor scaling. ASET started a 4-year project to reduce mask manufacturing cost and TAT by optimizing Mask Data Preparation (MDP), mask writing, and mask inspection in 2006, with the support from the New Energy and Industrial Technology Development Organization (NEDO). We report on the development of a new low cost mask inspection technology with short Turn Around Time (TAT), as a result of adopting a method of selecting defect detection sensitivity level for every local area, defined by such factors as defect judgment algorithm and defect judgment threshold, as one of the pseudo-defect-reduction technique necessary to shorten mask inspection TAT. Those factors are extracted from the database of Mask Data Rank (MDR) and converted on the basis of pattern prioritization determined at device design stage, using parallel computation.

Citation Download Citation

Hideo Tsuchiya, Masakazu Tokita, Takehiko Nomura, and Tadao Inoue "Die-to-database mask inspection with variable sensitivity", Proc. SPIE 7028, Photomask and Next-Generation Lithography Mask Technology XV, 70282I (19 May 2008); https://doi.org/10.1117/12.793088

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