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Brian Du
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Publications (1)
Proceedings Article | 12 November 2024 Presentation + Paper
Comprehensive EUV fab data management solution bridging reticle and wafer inspections
Alice Fu, Howard Lin, Calvin Hung, Bing-Rui Li, Ellis Lu, Jerry Hsieh, Brandon Hurt, Ryan Carlson, Xinya Liu, Masaki Satake, Derui Li, Will Wang, Wallace Wang, Brian Du, Daojing Li, Yao Zhang, Zeyu Lei, Narayani Narasimhan, Daniel Price, Vikram Tolani
Proceedings Volume 13215, 1321509 (2024) https://doi.org/10.1117/12.3033686
KEYWORDS: Reticles, Semiconducting wafers, Defect inspection, Wafer inspection, High volume manufacturing, Extreme ultraviolet, Scanning electron microscopy, Extreme ultraviolet lithography, Printing, Manufacturing
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