Ms. Carol Boye Profile

Carol Boye

Project Manager at IBM Corp

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Author

Publications (5)

Proceedings Article | 28 April 2011 Paper

High-throughput critical dimensions uniformity (CDU) measurement of two-dimensional (2D) structures using scanning electron microscope (SEM) systems

Jennifer Fullam, Carol Boye, Theodorus Standaert, John Gaudiello, Derek Tomlinson, Hong Xiao, Wei Fang, Xu Zhang, Fei Wang, Long Ma, Yan Zhao, Jack Jau

Proceedings Volume 7971, 79710Y (2011) https://doi.org/10.1117/12.879910

KEYWORDS: Critical dimension metrology, Semiconducting wafers, Scanning electron microscopy, Inspection, Electron microscopes, Defect inspection, Data acquisition, Etching, Field effect transistors

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Proceedings Article | 20 March 2010 Paper

Assessing EUV mask defectivity

Uzodinma Okoroanyanwu, Anna Tchikoulaeva, Paul Ackmann, Obert Wood, Bruno La Fontaine, Karsten Bubke, Christian Holfeld, Jan Hendrik Peters, Sumanth Kini, Sterling Watson, Isaac Lee, Bo Mu, Phillip Lim, Sudhar Raghunathan, Carol Boye

Proceedings Volume 7636, 76360J (2010) https://doi.org/10.1117/12.847348

KEYWORDS: Reticles, Inspection, Photomasks, Semiconducting wafers, Extreme ultraviolet, Defect detection, Line edge roughness, Scanning electron microscopy, Defect inspection, Optical lithography

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Proceedings Article | 18 March 2009 Paper

EUVL reticle defectivity evaluation

A. Tchikoulaeva, U. Okoroanyanwu, O. Wood, B. La Fontaine, C. Holfeld, S. Kini, M. Peikert, C. Boye, C.-S. Koay, K. Petrillo, H. Mizuno

Proceedings Volume 7271, 727117 (2009) https://doi.org/10.1117/12.815525

KEYWORDS: Reticles, Inspection, Semiconducting wafers, Wafer inspection, Scanning electron microscopy, Photomasks, Defect detection, Extreme ultraviolet lithography, Extreme ultraviolet, Multilayers

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Proceedings Article | 24 May 2004 Paper

A new optical technique for monitoring wafer curvature and stress during copper damascene processing

Carol Boye, Ronald Carpio, Jennifer Woodring, David Owen

Proceedings Volume 5375, (2004) https://doi.org/10.1117/12.537536

KEYWORDS: Semiconducting wafers, Copper, Chemical mechanical planarization, Metals, Thin films, Annealing, Wafer-level optics, Etching, Data processing, Capacitance

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Proceedings Article | 15 July 2003 Paper

Industry survey on nonvisual defect detection

Carol Boye

Proceedings Volume 5041, (2003) https://doi.org/10.1117/12.485211

KEYWORDS: Defect detection, Manufacturing, Semiconducting wafers, Semiconductors, Inspection, Semiconductor manufacturing, Failure analysis, Optics manufacturing, Detector development, Overlay metrology

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Conference Committee Involvement (4)

Data Analysis and Modeling for Patterning Control III

23 February 2006 | San Jose, California, United States

Data Analysis and Modeling for Process Control II

3 March 2005 | San Jose, California, United States

Data Analysis and Modeling for Process Control

26 February 2004 | Santa Clara, California, United States

Process and Materials Characterization and Diagnostics in IC Manufacturing II

27 February 2003 | Santa Clara, CA, United States

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