In this paper, an innovative concept of optical component for CO2 laser operating industrial robot is presented. The robot was rebuild and adapted for special optical path for up to 6kW CO2 laser beam to follow all of its joints up to cutting head. Originally, welding robots have some joints hollow inside. This fact was used to carry on laser beam inside robot joints. The idea for this concepts comes from the fact, that CO2 laser beam cannot be put into fiber, like in case of fiber lasers. Moreover, CO2 laser have enormous advantage over other IR lasers in cutting polymers, plastics and thermoforming materials due to its absorption for the 10,6 μm wavelength [1]. In this paper, a result of industrial robot cage with fume extraction system is presented.
We present the results of the experimental parametric study on efficiency, accuracy and quality of femtosecond laser micromachining of different materials. The laser micromachining process was performed with a solid-state Yb:KYW laser. The laser generates 500 fs pulses of three different wavelengths, repetition rate from 100 to 900 kHz and output power up to 50 W. This allows to perform a complex research for a wide range of parameters and materials. Laser micromachining is a process based on a laser ablation phenomenon, i.e. total evaporation of material from the target surface during laser irradiation. It is the most precise method of material removal. Applying a femtosecond laser in the process, allows the use of ultra short pulses, with a duration of 10-15 seconds, while maintaining a high laser power. The concentration of energy within a single pulse is sufficiently high to cause the detachment of particles from the irradiated target without any thermal interactions with the surrounding material. Therefore, the removal of the material occurs only in the laser focus. This allows to avoid most of the unwanted effects of the heat affected zone (HAZ). It has been established, that the quality of laser ablation process using femtosecond pulses is much higher than while using the long pulsed lasers (i.e. nanosecond). The use of femtosecond laser pulses creates therefore an attractive opportunity for high quality micromachining of many groups of materials.
PCB (Printed Circuit Board) industry is a global business for many years. PCB can be found in every electronic devices and since it becomes smaller, lighter and more efficient, new sophisticated machines need to be developed to meet this demands. The main parameter for the manufacturing machines is throughput. In this paper a multi-diode laser system for UV exposure of the photoresist on Printed Circuit Board is presented. The multi-diode laser system presents high throughput at high resolution of the pattern as well as low development costs.
Femtosecond–pulse laser micromachining is based on a laser ablation phenomenon, i.e. total evaporation of material from the target surface during laser irradiation. It is the most precise method of material removal. Moreover it does not require any post processing. Removal of the material occurs only in the laser focus, since the lack of thermal interaction, neither heat affected zone (HAZ) nor debris ocur. Research results have shown that shortening the duration of the laser pulse significantly reduces HAZ, which translates into the high quality of the machined structures. It is the main argument for the use of femtosecond-pulse lasers in the precise micromachining. In this paper, a femtosecond laser system consisting of a solid-state oscillator and the ytterbium-doped pulse fiber amplifier are presented. Average beam power at 343 nm with mode-locking is 4W @25A and pulse length at the oscillator output is 500 fs. Laser micro and nano-machining has found application in different fields. It’s primary use is industrial micromachining of metals, ceramics, polymers, glass, biological material for medical use in eye surgery, and photovoltaic cells.
In this article, the concept of a prototype femtosecond laser micromachining system and a femtosecond solid-state
Yb:KYW laser is presented. Ultrashort laser pulses have many advantages over the long pulses in laser micromachining,
due to their unique ability to interact with different materials without transferring heat to them. This allows very precise
and pure laser-processing, clean cuts and sharp edges. A femtosecond laser micromachining device presented in this
article is equipped with high-precision galvo scanner, quality optical elements and automatic process supporting tools,
resulting in the maximum use of the femtosecond laser potential for precise micromachining and MEMS fabrication.
We investigated the dynamics of laser generated ablation plasma plume expanding in ambient air and dynamics of the sound wave generated by the expanding plasma. The ablation plasma plume was generated during nanosecond laser micromachining of the thin metal foil. The time-resolved images of the expanding plasma plume and sound wave were captured at several nanosecond intervals. Using captured images the expansion rate of the plasma plume was determined. The initial velocity of the plasma was found to vary from 6.0•103 m/s ± 0.3•103 m/s to 7.3•103 m/s ± 0.3•103 m/s depending on the laser fluence. The initial velocity of the sound wave generated by the expending plasma plume also varies with laser fluence. We also investigated sound wave using acoustic microphone. Based on obtained results we proposed a method for automatic focusing of the laser beam before laser micromachining that involves sound wave acoustic signal analysis.
The interconnection complexity of the PCB (Printed Circuit Boards) is still growing and new technologies are introduced
in the production of high density printed circuit boards. Recently the Laser Direct Imaging (LDI) technology is used for
imaging electric circuits directly on PCB without the use of a phototool or mask. We presents our laboratory system for
Laser Direct Imaging designed for tracks and spaces on PCB with minimum track/space widths distance of 50/50 μm. In
comparison with conventional photolithography method, this technology is much better for 50/50 μm track and spaces.
In our research we used photoresist with 50 μm resolution, but in case of using laser photoresists with better resolution
(e.g. 25 μm) it is possible to image tracks in super-fine-line technology (25/25 μm). Our laboratory system for LDI
consist of diode UV laser (λ=375 nm, P=9 mW), optical scanner head, telescope and XY planar table, which extends
scanner head working area into 15 × 25 cm usable area. A sophisticated computer software was developed to control this
system.
Systems for laser micromachining of the materials are very popular around the world. Unfortunately, this technology is
not used widely in Poland. This is a result of very high prices of systems for laser micromachining, which Polish
electronic manufacturers can not afford for. This article is focused on Polish proposition of the system for laser
micromachining, which is adapted to producing metal stencils used in PCB manufacturing. Metal stencils are used
during one of the PCB manufacturing steps. It allows to precisely position soldering paste on PCB laminate exactly on
soldering places.
The interconnection complexity of the PCB (Printed Circuit Boards) is still growing and new technologies are introduced
in the production of high density printed circuit boards. Recently the Laser Direct Imaging (LDI) technology is used for
imaging electric circuits directly on PCB without the use of a phototool or mask. We presents our laboratory system for
Laser Direct Imaging designed for tracks and spaces on PCB with minimum track/space widths distance of 50/50 μm. In
comparison with conventional photolithography method, this technology is much better for 50/50 μm track and spaces.
In our research we used photoresist with 50 μm resolution, but in case of using laser photoresists with better resolution
(e.g. 25 μm) it is possible to image tracks in super-fine-line technology (25/25 μm). Our laboratory system for LDI
consist of diode UV laser (λ=375 nm, P=9 mW), optical scanner head, telescope and XY planar table, which extends
scanner head working area into 15 × 25 cm usable area. A sophisticated computer software was developed to control this
system.
The increasing demands for miniaturization and better functionality of electronic components and devices have a
significant effect on the requirements facing the printed circuit board (PCB) industry. PCB manufactures are driving for
producing high density interconnect (HDI) boards at significantly reduced cost and reduced implementation time. The
interconnection complexity of the PCB is still growing and today calls for 50/50 μm or 25/25 μm technology are real.
Existing technologies are unable to offer acceptable solution. Recently the Laser Direct Imaging (LDI) technology is
considered as an answer for these challenges. LDI is a process of imaging electric circuits directly on PCB without the
use of a phototool or mask. The exposure of the photo-sensitive resist is carried out using a laser beam that is scanned
across photoresist surface and switched on and off by means of a computer control system according to the electrical
circuit pattern. Usually the laser used in the LDI generates a UV line, which is suitable to the commonly available
photoresists. In this paper we present the laboratory system for Laser Direct Imaging and also the recent results on
imaging the circuitry pattern on the PCB covered by a photosensitive resist.
Systems for laser micromachining of the materials are very popular around the world. Unfortunately, this technology is
not used widely in Poland. This is a result of very high prices of systems for laser micromachining, which Polish
electronic manufacturers can not afford for. This article is focused on Polish proposition of the system for laser
micromachining, which is adapted to producing metal stencils used in PCB manufacturing. Metal stencils are used
during one of the PCB manufacturing steps. It allows to precisely position soldering paste on PCB laminate exactly on
soldering places.
The increasing demands for miniaturization and better functionality of electronic components and devices have a
significant effect on the requirements facing the printed circuit board (PCB) industry. PCB manufactures are driving for
producing high density interconnect (HDI) boards at significantly reduced cost and reduced implementation time. The
interconnection complexity of the PCB is still growing and today calls for 50/50 &mgr;m or 25/25 &mgr;m technology are real.
Existing technologies are unable to offer acceptable solution. Recently the Laser Direct Imaging (LDI) technology is
considered as an answer for these challenges. LDI is a process of imaging electric circuits directly on PCB without the
use of a phototool or mask. The exposure of the photo-sensitive resist is carried out using a laser beam that is scanned
across photoresist surface and switched on and off by means of a computer control system according to the electrical
circuit pattern. Usually the laser used in the LDI generates a UV line, which is suitable to the commonly available
photoresists. Our laboratory system for Laser Direct Imaging is designed for tracks and spaces on PCB with minimum
width distance of 50/50 &mgr;m. In comparison with conventional photolithography method, this technology is much better
for 50/50 &mgr;m track and spaces. In our research we used photoresist with resolution 50 &mgr;m, but in case of using laser
photoresists with better resolution (e.g. 25 &mgr;m) it will be possible to image tracks in super-fine-line technology (25/25
&mgr;m). The comparison between two technology of creating mosaic pattern tracks on PCB proved that laser imaging is
promising technology in high density interconnects patterns, which are widely use in multilayered PCB and similar
applications.
The increasing demands for miniaturization of electronic components and devices is observed. This caused a significant effect on the requirements faced on the printed circuit board (PCB) industry. PCB manufactures are driving for producing high density interconnect (HDI) boards at significantly reduced cost and reduced implementation time. The interconnection complexity of the PCB is still growing and today calls for 50/50 μm or 25/25 μm technology are real. Existing technologies, e.g. photolithograpy, are unable to offer such resolution. Laser Direct Imaging (LDI) technology is considered as an answer for these challenges. LDI is a process of imaging electric circuits directly on PCB without the use of a mask. The exposure of the photo-sensitive resist is carried out using a laser beam that is scanned across photoresist surface and switched on and off by means of a computer control system according to the electrical circuit pattern. Usually the laser used in the LDI generates a UV line, which is suitable to the commonly available photoresists. In this paper we present our recent results on the use a UV Nd:YAG laser (λ=355 nm) for direct imaging the circuitry pattern on the PCB covered by a photosensitive resist.
The increasing demands for miniaturization and better functionality of electronic components and devices have a significant effect on the requirements facing the Printed Circuit Board (PCB) industry. PCB manufactures are driving for producing high density interconnect (HDI) boards at significantly reduced cost and reduced implementation time. The interconnection complexity of the PCB is still growing and today calls for 50/50 μm or 25/25 μm technology are real. Imaging of HDI boards poses a rapid increasing challenge on PCB manufactures due to line width and space getting smaller and mainly to tighter registration requirements. Existing technologies are unable to offer the acceptable solution. Nowadays the Laser Direct Imaging (LDI) technology is considered as an answer for these challenges. LDI is a process of imaging circuitry pattern directly on the PCB without the use of a phototool. The exposure of the photo-sensitive resist is carried out using a laser beam that is scanned across photoresist surface and switched on and off by means of a computer control system according to the electrical circuit pattern. Usually the laser used in the LDI generates the UV line, which is suitable for the commonly available photoresists. In this paper we present an introduction to LDI technology as well as an experiment consisted in an attempt to use a UV Nd:YAG laser (λ=355 nm) for direct imaging of conductive pattern on the PCB covered by photosensitive resist.
Experimental results on the micro-hole drilling, hole trepanning and micro-cutting in thin metal foils using both competing lasers: CuBr and Nd:YAG (532 nm) are presented in this paper. The micromachining were carried out in aluminium (150 μm), brass (150 μm), stainless-steel (200 μm) and copper (50 μm) foils. The experiment results shows, that the Nd:YAG laser is more reliable and stable than the CuBr laser when the precision processing of the materials is considered. However the CuBr quasi-tophat beam results in more accurate for material processing than the Nd:YAG laser Gaussian beam.
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