Mr. Si-Cong Wang Profile

Si-Cong Wang

at Huazhong University of Science and Technology

SPIE Involvement:

Author

Publications (4)

Proceedings Article | 20 March 2020 Paper

VIA dishing metrology for novel 3D NAND using neural network assisted white light interferometry

Sicong Wang, Xiaoye Ding, Yi Zhou, Yanzhong Ma, Le Yang, Chi Chen, Lu Chen

Proceedings Volume 11325, 113250B (2020) https://doi.org/10.1117/12.2550947

KEYWORDS: Metrology, Atomic force microscopy, Neural networks, Image processing, Semiconducting wafers, 3D metrology, Optical interferometry

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Proceedings Article | 20 March 2019 Paper

Copper interconnect topography simulation in 3D NAND designs

Yang Li, Rick Li, Peng Jiang, Luming Fan, Aman Zheng, Sicong Wang, Guangyi Wang, Zhengfang Liu, Chunshan Du, Ruben Ghulghazaryan, Qijian Wan, Xinyi Hu

Proceedings Volume 10962, 1096210 (2019) https://doi.org/10.1117/12.2515161

KEYWORDS: Chemical mechanical planarization, 3D modeling, Manufacturing, Process modeling, Data modeling, Copper, Semiconducting wafers, Back end of line, Chemical vapor deposition, Design for manufacturability

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Proceedings Article | 20 March 2019 Paper

FEOL CMP modeling challenges and solution in 3D NAND

Yang Li, Rick Li, Peng Jiang, Luming Fan, Aman Zheng, Sicong Wang, Guangyi Wang, Chunshan Du, Zhengfang Liu, Ruben Ghulghazaryan, Qijian Wan, Xinyi Hu

Proceedings Volume 10962, 1096211 (2019) https://doi.org/10.1117/12.2515167

KEYWORDS: Chemical mechanical planarization, 3D modeling, Data modeling, Front end of line, Calibration, Polishing, Oxides, Manufacturing, Process modeling, Transmission electron microscopy

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Proceedings Article | 20 March 2019 Paper

Novel pattern-centric solution for high performance 3D NAND VIA dishing metrology

Sicong Wang, Jian Mi, Abhishek Vikram, Gao Xu, Guojie Cheng, Liming Zhang, Pan Liu

Proceedings Volume 10962, 1096217 (2019) https://doi.org/10.1117/12.2524569

KEYWORDS: Metrology, Semiconducting wafers, Image processing, Metals, 3D metrology, Atomic force microscopy, Chemical mechanical planarization, 3D image processing, Wafer bonding, Data processing

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