Thomas Yang
at Semiconductor Manufacturing International Corp
SPIE Involvement:
Author
Publications (3)

Proceedings Article | 30 March 2017 Presentation + Paper
Proceedings Volume 10148, 101480W (2017) https://doi.org/10.1117/12.2259950
KEYWORDS: Failure analysis, Diagnostics, Silicon, Semiconducting wafers, Defect detection, Process engineering, Diagnostic tests, Product engineering, Data processing, Yield improvement, Electrical breakdown, Signal detection

Proceedings Article | 30 March 2017 Paper
Proceedings Volume 10148, 101481D (2017) https://doi.org/10.1117/12.2259944
KEYWORDS: Electrical breakdown, Profiling, Failure analysis, Structural design, Manufacturing, Inspection, Multilayers, Data analysis, Data modeling, Measurement devices, Statistical analysis

Proceedings Article | 30 March 2017 Paper
Proceedings Volume 10148, 101481C (2017) https://doi.org/10.1117/12.2259947
KEYWORDS: Failure analysis, Diagnostic tests, Diagnostics, Product engineering, Semiconducting wafers, Electrical breakdown, Defect detection, Structural design, Manufacturing, Optical proximity correction

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