We report on a study using VCSEL Quick Fabrication (VQF) devices for the rapid assessment of epitaxial structures designed for emission at 894nm grown on 100mm substrates. A comparison of measured VQF device results to the epitaxial design specification allows for the extraction of key variances across the wafer and the identification of their potential causes. We also demonstrate the applicability of this technique for the assessment of uniformity and reproducibility of 150mm VCSEL wafers for emission at 940nm, identifying the potential sources for observed variations in device performance that impact in specification device yield.
Development of a quick fabrication (QF) method for commercial wafer characterisation based on rapid feedback of VCSEL performance. We report on the design of the fabrication process including the systematic removal of time-consuming steps of planarization, oxidation and substrate lapping, and the associated impact on device performance and yield. We show comparable performance of the oxide-confined QF etched trench VCSELs and full process devices and we show that unoxidised devices behave as large aperture oxidised devices. Further, we demonstrate similar performance of substrate-lapped and -unlapped VCSELs between 1.0-1.2 Ith with a difference in current tuning typically 0.064nm/mA.
High-volume low-cost production of vertical cavity surface emitting lasers (VCSELs) will allow their exploitation in new commodity markets. We report the successful scaling up from research level fabrication to produce oxide confined VCSELs across a whole 150mm wafer. On-wafer light-current-voltage (L-I-V) and spectral measurements are analyzed to determine the cross-wafer variations in threshold current, threshold current densities and emission wavelength, which is compared with reflectivity measurements taken immediately after growth. We examine the dependence of VCSEL performance on fabrication parameters over a range of device dimensions to assess whether variation arises from non-uniformity of the epitaxial material or wafer processing.
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