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Prof. Zhaohua Feng
at Univ of Wisconsin Madison
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Author
Publications (4)
Proceedings Article | 6 December 2004 Paper
Simulating the effects of bake process parameters on resist thermal reflow
Proceedings Volume 5567, (2004) https://doi.org/10.1117/12.568860
KEYWORDS: Semiconducting wafers, Silicon, Photoresist processing, Thermal modeling, Convection, Polymers, Temperature metrology, Radium, Lithography, Interfaces
Proceedings Article | 17 December 2003 Paper
Modeling thermal reflow of resist contact hole arrays
Proceedings Volume 5256, (2003) https://doi.org/10.1117/12.517886
KEYWORDS: Polymers, Photoresist processing, Lithography, Solids, Thermal modeling, Semiconducting wafers, Interfaces, Finite element methods, Analytical research, Silicon
Proceedings Article | 16 June 2003 Paper
EUV mask stress mapping by an experimental and hybrid finite element technique
Proceedings Volume 5037, (2003) https://doi.org/10.1117/12.490139
KEYWORDS: Photomasks, Extreme ultraviolet, Multilayers, Reticles, Reflectors, Lithography, Distortion, Extreme ultraviolet lithography, Chromium, Spherical lenses
Proceedings Article | 5 June 1998 Paper
Transient thermal distortions of x-ray mask membranes during exposure scanning
Zhaohua Feng, Roxann Engelstad, Edward Lovell, Franco Cerrina
Proceedings Volume 3331, (1998) https://doi.org/10.1117/12.309579
KEYWORDS: Photomasks, X-rays, 3D modeling, X-ray lithography, Finite element methods, Thermal modeling, Semiconducting wafers, Silicon carbide, Standards development, Convection
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