A new development algorithm to optimize scanner alignment sampling for cross-chuck overlay performance optimization

Chieh-Chen Chiu; Feng Tian; Wei Feng; Mingqi Gao; Andy Lan; Chao-Jen Tsou; Shengyuan Zhong; Norman Birnstein; Robin Maximilian Zech; Clemens Utzny; Jin Zhu; Jincheng Pei; Kevin Huang

doi:10.1117/12.2627283

26 May 2022 A new development algorithm to optimize scanner alignment sampling for cross-chuck overlay performance optimization

Chieh-Chen Chiu, Feng Tian, Wei Feng, Mingqi Gao, Andy Lan, Chao-Jen Tsou, Shengyuan Zhong, Norman Birnstein, Robin Maximilian Zech, Clemens Utzny, Jin Zhu, Jincheng Pei, Kevin Huang

Author Affiliations +

Proceedings Volume 12053, Metrology, Inspection, and Process Control XXXVI; 1205329 (2022) https://doi.org/10.1117/12.2627283
Event: SPIE Advanced Lithography + Patterning, 2022, San Jose, California, United States

Conference Poster

Abstract

In a leading-edge high-volume manufacturing fab, lithographers focus on searching for a suitable alignment layout strategy to cover process-induced overlay variation. However, how to minimize scanner cross-chuck overlay impact also draws attention due to WPH loss from chuck dedication. In this paper we evaluate a novel algorithm to analyze lithography scanner process/metrology data and introduce a new KPI called “model accuracy” for alignment sampling layout strategy creation, which takes into account robustness index as wafer-to-wafer/chuck-to-chuck variation. Combined with simulated overlay performance, an optimal alignment layout strategy is recommended for a maximum coverage of cross-chuck overlay, which leads to maximum productivity.

Conference Presentation

Citation Download Citation

Chieh-Chen Chiu, Feng Tian, Wei Feng, Mingqi Gao, Andy Lan, Chao-Jen Tsou, Shengyuan Zhong, Norman Birnstein, Robin Maximilian Zech, Clemens Utzny, Jin Zhu, Jincheng Pei, and Kevin Huang "A new development algorithm to optimize scanner alignment sampling for cross-chuck overlay performance optimization", Proc. SPIE 12053, Metrology, Inspection, and Process Control XXXVI, 1205329 (26 May 2022); https://doi.org/10.1117/12.2627283

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available