We demonstrate the co-integration of SiN waveguide-based building block components in an established 200 mm Silicon photonics platform, extending its capabilities to the 1 µm wavelength range, and addressing bioimaging applications based on Optical Coherence Tomography (OCT). Measured coupling and propagation loss, at wafer-scale, are low for edge couplers (< 2 dB), and PECVD SiN waveguides (< 0.4 dB/cm) respectively. SiN waveguide-coupled Ge-on-Si photodetectors with 0.6 A/W responsivity at 1060 nm and dark currents lower than 15 nA at -1 V operating voltage were achieved at wafer-scale, with a smaller footprint compared to standard Si-based photodetectors. This platform has the potential to be used for a variety of applications, such as optical communications, imaging, and sensing. The achieved results at 1060 nm pave the way for the deployment of miniaturized OCT-based devices to enable large scale patient diagnosis.
Silicon photonics is now considered the photonics platform of choice for short-reach data center single mode pluggable transceivers. With the emergence of co-packaged optics concepts, it can also enable high performance computing with power-efficient interconnect, but also Lidar system integration or even optical quantum computing. In this paper we will present an overview of what can be achieved in state-of-the-art silicon photonics platforms and we will discuss some of the emerging technology trends. In particular, we will discuss the integration of LPCVD SiN in an active silicon photonics platform.
This paper presents the necessary building blocks towards the realization of on-chip, lens-free, spectrally selective, THz beam steering. We demonstrate continuous wave (CW) THz generation up to 2.2 THz by photomixing using antenna-coupled silicon-integrated germanium photodiodes, which reach an optical-to-THz conversion efficiency of about 1% at 100 GHz. We show THz beam forming within a small antenna array and address key challenges towards the realization of large quasi-optical THz phased arrays, by demonstrating low-loss (<0.2 dB/cm), low phase error routing and optical beam steering within hybrid Si/SiN optical phased arrays. Finally, we present an anti-reflection structure enabling lensfree THz beam steering.
The rapid increase of bandwidth requirements across the entire hierarchy of Data Center (DC) networks, ranging from chip-to-chip, board-to-board up to rack-to-rack communications, puts strenuous requirements in the underlying network infrastructure that has to offer high-bandwidth and low-latency interconnection under a low-energy and low-cost envelope. Arrayed Waveguide Grating Router (AWGR)-based optical interconnections have emerged as a powerful architectural framework that can overcome the currently deployed electrical interconnect bottlenecks leveraging the wavelength division multiplexing (WDM) and the cyclic routing properties of AWGRs to offer one-hop, all-to-all communication when employed as N×N routers. However, the majority of previous silicon (Si)-based integrated AWGR demonstrations has either targeted C-band operation, despite the dominance of the O-band spectral region in the DC interconnection domain, or offered coarse-WDM (CWDM) functionality and, as such, were limited in terms of AWGR port count. In this article, we present for the first time to our knowledge, a Dense-WDM (DWDM) 16×16 Si-photonic cyclic-frequency AWGR device targeting O-band routing applications. The fabricated AWGR device features a channel spacing of 1.063 nm (189 GHz), a free spectral range of 17.8 nm (3.15 THz) and a 3-dB bandwidth of 0.655 nm (116 GHz). Its proper cyclic frequency operation was experimentally verified for all 16 channels with channel peak insertion loss values in the range of 3.9 dB to 8.37 dB, yielding a channel loss non-uniformity of 4.47 dB. Its compact footprint of 0.27×0.71 mm2 and low crosstalk of 21.65 dB highlight its potential for employment in future AWGR-based interconnection schemes.
Terahertz (THz) imaging has progressed tremendously due the continuous development of new THz emitters and detectors. However, highly integrated array devices are desired for fast THz imaging. Advanced features such as beam steering and phase contrast imaging may be realized using more complex systems that require tight integration. Silicon photonics is an enabler for CW THz applications such as imaging and high-speed communication because of low cost and high level of integration. We present results of our research on continuous-wave THz generation using antennacoupled silicon-germanium photodiodes. THz emission up to 2.2 THz has been demonstrated.
Within the European Project TERABOARD, a photonic integration platforms including electronic-photonic integration is developed to demonstrate high bandwidth high-density modules and to demonstrate cost and energy cost target objectives. Large count high bandwidth density EO interfaces for onboard and intra-data center interconnection are reported. For onboard large count interconnections a novel concept based on optical-TSV interconnection platform with no intersections and no WDM multiplexing is reported. All input/output coupler arrays based on a pluggable silica platform are reported as well.
Silicon photonics has become in the past years an important technology adopted by a growing number of
industrial players to develop their next generation optical transceivers. However most of the technology
platforms established in CMOS fabrication lines are kept captive or open to only a restricted number of
customers. In order to make silicon photonics accessible to a large number of players several initiatives exist
around the world to develop open platforms. In this paper we will present imec’s silicon photonics active
platform accessible through multi-project wafer runs.
System performance scaling imposes an increase of package-to-package aggregate bandwidths to interface chips in high performance computing. This scaling is expected to encounter several I/O bottlenecks (pin count, speed, power consumption) when implemented in the electrical domain. Several optical interface technologies are being proposed among which silicon photonics, considered as a promising candidate. In this paper we will review the recent progress made in this technology that may enable multi-channel WDM links for package-to-package interconnects: 1.0V drivers with microring modulators and compact manufacturable microring filters with efficient thermal tuning.
A Si photonics platform is described, co-integrating advanced passive components with Si modulators and Ge detectors.
This platform is developed on a 200mm CMOS toolset, compatible with a 130nm CMOS baseline. The paper describes
the process flow, and describes the performance of selected electro-optical devices to demonstrate the viability of the
flow.
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