Dr. Youngjoon Lee Profile

Dr. Youngjoon Lee

Senior Staff Scientist at Sumitomo Chemical Co Ltd

SPIE Involvement:

Author

Publications (4)

Proceedings Article | 26 March 2008 Paper

Molecular resists for EUV and EB lithography

Masayuki Takashima, Ichiki Takemoto, Hiroyuki Yokoyama, Kunishige Edamatsu, Nobuo Ando, Youngjoon Lee

Proceedings Volume 6923, 69231N (2008) https://doi.org/10.1117/12.771880

KEYWORDS: Line edge roughness, Lithography, Extreme ultraviolet lithography, Ions, Extreme ultraviolet, Polymers, Photoresist materials, Chemical analysis, Molecules, Chemically amplified resists

Read Abstract +

Proceedings Article | 11 April 2006 Paper

Low leaching and low LWR photoresist development for 193 nm immersion lithography

Takayuki Miyagawa, Satoshi Yamamoto, Youngjoon Lee, Ichiki Takemoto, Nobuo Ando, Kunishige Edamatsu, Shinji Konishi, Fujiwara Tomoharu, Yoshinobu Tsuchida, Katsushi Nakano, Keiko Yamamoto

Proceedings Volume 6153, 615322 (2006) https://doi.org/10.1117/12.655586

KEYWORDS: Line width roughness, Polymers, Diffusion, Semiconducting wafers, Immersion lithography, Photoresist materials, Lithography, Photoresist developing, Scanners, Molecules

Read Abstract +

With no apparent showstopper in sight, the adoption of ArF immersion technology into device mass production is not a matter of 'if' but a matter of 'when'. As the technology matures at an unprecedented speed, many of initial technical difficulties have been cleared away and the use of a protective layer known as top coat, initially regarded as a must, now becomes optional, for example. Our focus of interest has also sifted to more practical and production related issues such as defect reducing and performance enhancement. Two major types of immersion specific defects, bubbles and a large number of microbridges, were observed and reported elsewhere. The bubble defects seem to decrease by improvement of exposure tool. But the other type defect - probably from residual water spots - is still a problem. We suspect that the acid leaching from resist film causes microbridges. When small water spots were remained on resist surface after exposure, acid catalyst in resist film is leaching into the water spots even though at room temperature. After water from the spot is dried up, acid molecules are condensed at resist film surface. As a result, in the bulk of resist film, acid depletion region is generated underneath the water spot. Acid catalyzed deprotection reaction is not completed at this acid shortage region later in the PEB process resulting in microbridge type defect formation. Similar mechanism was suggested by Kanna et al, they suggested the water evaporation on PEB plate. This hypothesis led us to focus on reducing acid leaching to decrease residual water spot-related defect. This paper reports our leaching measurement results and low leaching photoresist materials satisfying the current leaching requirements outlined by tool makers without topcoat layer. On the other hand, Nakano et al reported that the higher receding contact angle reduced defectivity. The higher receding contact angle is also a key item to increase scan speed. The effort to increase the receding contact angle become very important issue for not only defectivity but also scanner throughput. Some of our experimental results along this line of study are also included in the report. The last topic covered is LWR (Line Width Roughness) as an essential leverage for performance improvement, especially for the smaller CD that immersion lithography is aiming to define. Our recent effort to find effect and working concept to reduce LWR with low leaching materials is also described.

Proceedings Article | 4 May 2005 Paper

Tailoring thermal property of ArF resists resins through monomer structure modification for sub-70-nm contact hole application by reflow process

Isao Yoshida, Satoshi Yamaguchi, Takayuki Miyagawa, Ichiki Takemoto, Yusuke Fuji, Shinji Konishi, Kenji Takahashi, Youngjoon Lee, Kazuhiko Hashimoto

Proceedings Volume 5753, (2005) https://doi.org/10.1117/12.597135

KEYWORDS: Polymers, Photoresist processing, Glasses, Carbon monoxide, Lithography, Carbon, Chemical species, Line edge roughness, Diffusion, Molecules

Read Abstract +

Proceedings Article | 12 June 2003 Paper

Investigation of cyclopolymerization for ArF positive photoresist

Hiroaki Fujishima, Ryotaro Hanawa, Yasunori Uetani, Kazuhiko Hashimoto, Youngjoon Lee

Proceedings Volume 5039, (2003) https://doi.org/10.1117/12.485064

KEYWORDS: Polymerization, Polymers, Lithography, Dry etching, Resistance, Photoresist materials, Metals, Etching, Chemistry, Optical lithography

Read Abstract +

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Keywords/Phrases

Search In:

Publication Years