Mr. Eric Chin Profile

Eric Chin

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Publications (5)

Proceedings Article | 19 May 2011 Paper

Collaborative research on emerging technologies and design

Cooper Levy, Kun Qian, Tuck Boon Chan, Lynn Wang, Costas Spanos, Rani Ghaida, Kenji Yamazoe, Abde Kaqalwalla, Kwangok Jeong, Kameshwar Poolla, Andrew Neureuther, Nuo Xu, Marshal Miller, Justin Ghan, Puneet Gupta, Eric Chin, Xin Sun, Juliet Rubinstein, Tsu-Jae King Liu, Anand Subramanian

Proceedings Volume 8081, 80810N (2011) https://doi.org/10.1117/12.899394

KEYWORDS: Photomasks, Double patterning technology, Lithography, Image processing, Line edge roughness, Algorithm development, Reticles, Inspection, Design for manufacturing, Device simulation

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Proceedings Article | 3 April 2010 Paper

Variability aware timing models at the standard cell level

Eric Chin, Cooper Levy, Andrew Neureuther

Proceedings Volume 7641, 76410H (2010) https://doi.org/10.1117/12.846689

KEYWORDS: Transistors, Lithography, Device simulation, Instrument modeling, Capacitance, Performance modeling, 193nm lithography, Standards development, Data modeling, Semiconducting wafers

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Proceedings Article | 13 March 2009 Paper

Variability aware interconnect timing models for double patterning

Eric Chin, Andrew Neureuther

Proceedings Volume 7275, 727513 (2009) https://doi.org/10.1117/12.814281

KEYWORDS: Double patterning technology, Lithography, Metals, Capacitance, Critical dimension metrology, Optical lithography, Resistance, Device simulation, Signal processing, Instrument modeling

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Proceedings Article | 28 March 2007 Open Access

Collaborative platform, tool-kit, and physical models for DfM

Mike Lieberman, Alan Wu, Chris Clifford, John Hoang, Jane Chang, David Graves, Jerry Hsu, Dan Ceperley, Juliet Holwill, Marshal Miller, Eric Chin, Costas Spanos, Jihong Choi, Jae-Seok Yang, Dave Dornfeld, Lynn Wang, Andy Neureuther, Wojtek Poppe, Paul Friedberg, Koji Kikuchi

Proceedings Volume 6521, 652104 (2007) https://doi.org/10.1117/12.721199

KEYWORDS: Design for manufacturing, Photomasks, Device simulation, Computer aided design, Process modeling, Etching, Monochromatic aberrations, Manufacturing, Lithography, Chemical mechanical planarization

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Proceedings Article | 21 March 2007 Paper

Prediction of interconnect delay variations using pattern matching

Juliet Holwill, Eric Chin, Andrew Neureuther

Proceedings Volume 6521, 65210I (2007) https://doi.org/10.1117/12.712257

KEYWORDS: Capacitance, Resistance, Lithography, Monochromatic aberrations, Metals, Process modeling, Etching, Chemical mechanical planarization, Critical dimension metrology, Inspection

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