Rudolf Wilhelm
at Nearfield Instruments
SPIE Involvement:
Author
Publications (3)

Proceedings Article | 10 April 2024 Poster
Proceedings Volume 12955, 129552U (2024) https://doi.org/10.1117/12.3010488
KEYWORDS: Semiconducting wafers, High volume manufacturing, Metrology, Copper, Chemical mechanical planarization, Surface finishing, Semiconductor manufacturing, Process control, Miniaturization, Atomic force microscopy

Proceedings Article | 10 April 2024 Poster
Proceedings Volume 12955, 1295531 (2024) https://doi.org/10.1117/12.3010719
KEYWORDS: Extreme ultraviolet lithography, Metrology, 3D metrology, Nondestructive evaluation, Line width roughness, Atomic force microscopy, Surface roughness, Photoresist materials, Line edge roughness, Algorithm development

Proceedings Article | 10 April 2024 Poster
Proceedings Volume 12955, 129552T (2024) https://doi.org/10.1117/12.3010482
KEYWORDS: Metrology, Semiconducting wafers, Copper, Chemical mechanical planarization, Surface roughness, High volume manufacturing, Atomic force microscopy, Wafer bonding, Wafer testing, System integration

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