Mr. Seokhan Kim Profile

Seokhan Kim

at Nearfield Instruments BV

SPIE Involvement:

Author

Publications (5)

Proceedings Article | 10 April 2024 Poster

Validation of high-throughput AFM for copper pad metrology in high volume manufacturing

Kyung Souk Yi, Min Hong, Jiyeon Kim, Eunpa Kim, Kwang Soo Kim, Kyong Wook Noh, Su-Young Lee, Myungjun Lee, Yusin Yang, Hokyun Chin, Arseniy Kalinin, Irene Battisti, Erik Simons, Seokhan Kim, ShihWei Yu, Nelda Antonovaité, Niranjan Saikumar, Rudolf Wilhelm, Hamed Sadeghian

Proceedings Volume 12955, 129552U (2024) https://doi.org/10.1117/12.3010488

KEYWORDS: Semiconducting wafers, High volume manufacturing, Metrology, Copper, Chemical mechanical planarization, Surface finishing, Semiconductor manufacturing, Process control, Miniaturization, Atomic force microscopy

Proceedings Article | 10 April 2024 Poster

Validation of non-destructive 3D probe-based metrology for EUV lithography

Nelda Antonovaité, ShihWei Yu, Khalid Elsayed, Erik Simons, Hokyun Chin, Arseniy Kalinin, Irene Battisti, Helda Pahlavani, Seokhan Kim, Artem Khachaturiants, Niranjan Saikumar, Rudolf Wilhelm, Hamed Sadeghian

Proceedings Volume 12955, 1295531 (2024) https://doi.org/10.1117/12.3010719

KEYWORDS: Extreme ultraviolet lithography, Metrology, 3D metrology, Nondestructive evaluation, Line width roughness, Atomic force microscopy, Surface roughness, Photoresist materials, Line edge roughness, Algorithm development

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Proceedings Article | 10 April 2024 Poster

High throughput, angstrom-level metrology for copper-copper hybrid bonding

Arseniy Kalinin, Niranjan Saikumar, Irene Battisti, Erik Simons, Seokhan Kim, ShihWei Yu, Hokyun Chin, Artem Khachaturiants, Cong Chen, Bensu Tunca Altintas, Soon Aik Chew, Boyao Zhang, Nelda Antonovaité, Rudolf Wilhelm, Alain Moussa, Janusz Bogdanowicz, Anne-Laure Charley, Hamed Sadeghian

Proceedings Volume 12955, 129552T (2024) https://doi.org/10.1117/12.3010482

KEYWORDS: Metrology, Semiconducting wafers, Copper, Chemical mechanical planarization, Surface roughness, High volume manufacturing, Atomic force microscopy, Wafer bonding, Wafer testing, System integration

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Proceedings Article | 16 September 2022 Paper

High-NA EUV photoresist metrology using high-throughput scanning probe microscopy

M. Mucientes, A. Khachaturiants, R. Trussell, A. Kalinin, Y. Guo, E. Simons, S. Kim, O. Nadyarnykh, A. Moussa, J. Bogdanowicz, J. Severi, G. Lorusso, D. De Simone, A.-L. Charley, P. Leray, M. van Reijzen, C. Bozdog, H. Sadeghian

Proceedings Volume 12325, 123250M (2022) https://doi.org/10.1117/12.2641698

KEYWORDS: Scanning probe microscopy, Semiconducting wafers, Metrology, Optical lithography, Bridges, Extreme ultraviolet lithography, Defect inspection, Photoresist materials, Inspection, Atomic force microscopy

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Proceedings Article | 13 June 2022 Presentation

High throughput scanning probe metrology for high-NA EUV photoresist profiling

Artem Khatchaturiants, Marta Mucientes, Arseniy Kalinin, Yan Guo, Seokhan Kim, Alain Moussa, Janusz Bogdanowicz, Joren Severi, Gian Lorusso, Danilo De Simone, Anne-Laure Charley, Philippe Leray, Maarten van Reijzen, Cornel Bozdog, Hamed Sadeghian

Proceedings Volume PC12053, PC120530I (2022) https://doi.org/10.1117/12.2616089

KEYWORDS: Scanning probe microscopy, Metrology, Photoresist materials, Extreme ultraviolet lithography, Scanning probe metrology, Profiling, Process control, Extreme ultraviolet, Atomic force microscopy, Stochastic processes

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