Mr. Shinroku Maejima Profile

Shinroku Maejima

at Renesas Technology Corp

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Author

Publications (16)

Proceedings Article | 16 March 2009 Paper

A proposed image intensity expressing local irradiance

Shuji Nakao, Itaru Kanai, Shinroku Maejima, Mitsuru Okuno, Naohisa Tamada, Junjiro Sakai, Akira Imai, Tetsuro Hanawa, Kazuyuki Suko

Proceedings Volume 7274, 72742Z (2009) https://doi.org/10.1117/12.812203

KEYWORDS: Polarization, Photomasks, Electromagnetism, Image filtering, Diffraction, Optical lithography, Magnetism, Lithography, Apodization, Radiometric corrections

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Proceedings Article | 19 May 2008 Paper

Application of super-diffraction-lithography (SDL) for advanced logic

Shuji Nakao, Shinroku Maejima, Yuko Mitarai, Takuya Hagiwara, Sachiko Ogawa, Tetsuro Hanawa, Kazuyuki Suko

Proceedings Volume 7028, 70283G (2008) https://doi.org/10.1117/12.793123

KEYWORDS: Photomasks, Critical dimension metrology, Photography, Resolution enhancement technologies, Printing, Immersion lithography, Logic, Transmittance, Scanning electron microscopy, Image processing

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Proceedings Article | 26 March 2008 Paper

A system to optimize mix-and-match overlay in lithography

Shinji Wakamoto, Yuuki Ishii, Koji Yasukawa, Shinroku Maejima, Atsuhiko Kato, John Robinson, Dong-Sub Choi

Proceedings Volume 6922, 69222V (2008) https://doi.org/10.1117/12.771778

KEYWORDS: Scanners, Distortion, Semiconducting wafers, Databases, Reticles, Lithography, Phase modulation, Overlay metrology, Distributed interactive simulations, Factor analysis

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Proceedings Article | 12 March 2008 Paper

Quasi-iso-focal hole pattern formation by Checker-Board PSM (CB-PSM)

S. Nakao, S. Maejima, A. Minamide, H. Saitoh, T. Hanawa, K. Suko

Proceedings Volume 6924, 692432 (2008) https://doi.org/10.1117/12.771615

KEYWORDS: Optical proximity correction, Photomasks, Opacity, Scanning electron microscopy, Photography, Optical lithography, Image transmission, Imaging systems, Image acquisition, Chromium

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Proceedings Article | 5 April 2007 Paper

Improved overlay control through automated high order compensation

S. Wakamoto, Y. Ishii, K. Yasukawa, A. Sukegawa, S. Maejima, A. Kato, J. Robinson, B. Eichelberger, P. Izikson, M. Adel

Proceedings Volume 6518, 65180J (2007) https://doi.org/10.1117/12.712710

KEYWORDS: Scanners, Distortion, Databases, Semiconducting wafers, Overlay metrology, Reticles, Control systems, Optical alignment, Lithography, Error analysis

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Proceedings Article | 26 March 2007 Paper

OPC-free on-grid fine random hole pattern formation utilizing double resist patterning with double RETs

Shuji Nakao, Shinroku Maejima, Takeshi Yamamoto, Yoshiharu Ono, Junjiro Sakai, Atsumi Yamaguchi, Akira Imai, Tetsuro Hanawa, Kazuyuki Sukoh

Proceedings Volume 6520, 65203W (2007) https://doi.org/10.1117/12.711055

KEYWORDS: Optical lithography, Scanning electron microscopy, Photography, Double patterning technology, Photomasks, Photoresist processing, Resolution enhancement technologies, Argon, Ion implantation, Current controlled current source

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Proceedings Article | 22 March 2007 Paper

Defect transfer from immersion exposure process to post processing and defect reduction using novel immersion track system

Osamu Miyahara, Takeshi Shimoaoki, Shinya Wakamizu, Junichi Kitano, Yoshiharu Ono, Shinroku Maejima, Tetsuro Hanawa, Kazuyuki Suko

Proceedings Volume 6519, 651924 (2007) https://doi.org/10.1117/12.711354

KEYWORDS: Etching, Immersion lithography, Photoresist processing, Semiconducting wafers, Lithography, Thin film coatings, Scanning electron microscopy, Defect inspection, Photography, Lens design

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As a promising way to scale down semiconductor devices, 193-nm immersion exposure lithography is being developed at a rapid pace and is nearing application to mass production. This technology allows the design of projection lens with higher numerical aperture (NA) by filling the space between the projection lens and the silicon wafer with a liquid (de-ionized water). However, direct contact between the resist film and water during exposure creates a number of process risks. There are still many unresolved issues and many problems to be solved concerning defects that arise in 193-nm immersion lithography. The use of de-ionized water during the exposure process in 193-nm immersion lithography can lead to a variety of problems. For example, the trapping of microscopic air bubbles can degrade resolution, and residual water droplets left on the wafer surface after immersion exposure can affect resolution in the regions under those droplets. It has also been reported that the immersion of resist film in de-ionized water during exposure can cause moisture to penetrate the resist film and dissolve resist components, and that immersion can affect critical dimensions as well as generate defects. The use of a top coat is viewed as one possible way to prevent adverse effects from the immersion of resist in water, but it has been reported that the same problems may occur even with a top coat and that additional problems may be generated, such as the creation of development residues due to the mixing of top coat and resist. To make 193-nm immersion lithography technology practical for mass production, it is essential that the above defect problems be solved. Importance must be attached to understanding the conditions that give rise to residual defects and their transference in the steps between lithography and the etching/cleaning processes. In this paper, we use 193-nm immersion lithography equipment to examine the transference (traceability) of defects that appear in actual device manufacturing. It will be shown that defect transfer to the etching process can be significantly reduced by the appropriate use of defect-reduction techniques.

Proceedings Article | 20 October 2006 Paper

A novel Alt-PSM structure: isn't this an embedded Atten-PSM?

S. Nakao, K. Hosono, S. Maejima, K. Narimatsu, T. Hanawa, K. Suko

Proceedings Volume 6349, 63492Q (2006) https://doi.org/10.1117/12.692820

KEYWORDS: Photomasks, Critical dimension metrology, Phase shifts, Image transmission, Chromium, Quartz, Printing, Logic devices, Scanning electron microscopy, Image quality

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Proceedings Article | 20 May 2006 Paper

Approximate method of mask flatness factor in focus deviation

Shinroku Maejima, Seiichiro Shirai, Akira Imai, Shuji Nakao, Koji Tange, Akira Chiba, Kunihiro Hosono, Koichiro Narimatsu

Proceedings Volume 6283, 62833A (2006) https://doi.org/10.1117/12.681829

KEYWORDS: Photomasks, Interferometers, Scanners, Semiconducting wafers, Monochromatic aberrations, Integrated circuits, Manufacturing, Critical dimension metrology, Overlay metrology, Inspection

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Proceedings Article | 11 April 2006 Paper

Studies on immersion defects using mimic immersion experiments

Tetsuro Hanawa, Toshifumi Suganaga, Takeo Ishibashi, Shinroku Maejima, Koichiro Narimatsu, Kazuyuki Suko, Mamoru Terai, Teruhiko Kumada, Junichi Kitano

Proceedings Volume 6153, 61531O (2006) https://doi.org/10.1117/12.655568

KEYWORDS: Thin film coatings, Immersion lithography, Lithography, Semiconducting wafers, Scanners, Photoresist processing, Contamination, Defect inspection, Chemical analysis, Absorption

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Proceedings Article | 21 March 2006 Paper

Verification of optical proximity effect in immersion lithography

Toshifumi Suganaga, Shinroku Maejima, Tetsuro Hanawa, Takeo Ishibashi, Shuji Nakao, Seiichiro Shirai, Koichiro Narimatsu, Kazuyuki Suko, Kenichi Shiraishi, Yuki Ishii, Tomoyuki Ando, Katsumi Ohmori

Proceedings Volume 6154, 61544K (2006) https://doi.org/10.1117/12.655526

KEYWORDS: Immersion lithography, Technetium, Lithography, Resonance energy transfer, Polymers, Manufacturing, Scanners, Scanning electron microscopy, Optics manufacturing, Optical coatings

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Proceedings Article | 15 March 2006 Paper

Application of super-diffraction lithography (SDL) for an actual device fabrication

Shuji Nakao, Shinroku Maejima, Itaru Kanai, Akihiro Nakae, Junjiro Sakai, Koichiro Narimatsu, Kazuyuki Suko

Proceedings Volume 6154, 61542A (2006) https://doi.org/10.1117/12.656043

KEYWORDS: Photomasks, Critical dimension metrology, Printing, Photography, Lithography, Scanning electron microscopy, Optical proximity correction, Logic devices, Resolution enhancement technologies, Binary data

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Proceedings Article | 26 June 2003 Paper

Simple and highly sensitive focus monitoring utilizing an aperture on backside of photomask

Shuji Nakao, Junjirou Sakai, Shinroku Maejima, Atsushi Ueno, Akihiro Nakae, Shigenori Yamashita, Ken-ichi Itano, Hidehiko Kozawa, Akira Tokui, Kouichirou Tsujita

Proceedings Volume 5040, (2003) https://doi.org/10.1117/12.485324

KEYWORDS: Photomasks, Semiconducting wafers, Chromium, Modulation, Overlay metrology, Monochromatic aberrations, Geometrical optics, Double patterning technology, Quartz, Wafer-level optics

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Proceedings Article | 30 July 2002 Paper

Implementation of phase-shift focus monitor with modified illumination

Shuji Nakao, Shinroku Maejima, Atsushi Ueno, Shigenori Yamashita, Junji Miyazaki, Akira Tokui, Kouichirou Tsujita, Ichiriou Arimoto

Proceedings Volume 4691, (2002) https://doi.org/10.1117/12.474643

KEYWORDS: Chromium, Semiconducting wafers, Phase shifts, Printing, Photomasks, Diffraction, Monochromatic aberrations, Wafer-level optics, Silicon, Sodium

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Proceedings Article | 30 July 2002 Paper

Simple estimation of lens aberration with pinhole aperture on the backside of photomask

Shuji Nakao, Shinroku Maejima, Shigenori Yamashita, Junji Miyazaki, Akira Tokui, Kouichirou Tsujita, Ichiriou Arimoto

Proceedings Volume 4691, (2002) https://doi.org/10.1117/12.474580

KEYWORDS: Photomasks, Diffraction, Binary data, Modulation, Optical simulations, Semiconducting wafers, Diffraction gratings, Monochromatic aberrations, Projection systems, Overlay metrology

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Proceedings Article | 30 July 2002 Paper

Simple focus monitoring by eccentric illumination aperture

Shuji Nakao, Shinroku Maejima, Naohisa Tamada, Shigenori Yamashita, Atsushi Ueno, Junji Miyazaki, Akira Tokui, Kouichirou Tsujita, Ichiriou Arimoto

Proceedings Volume 4691, (2002) https://doi.org/10.1117/12.474625

KEYWORDS: Semiconducting wafers, Photomasks, Overlay metrology, Imaging systems, Projection systems, Double patterning technology, Wafer-level optics, Printing, Diffraction, Calibration

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Showing 5 of 16 publications

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