Dr. Wei-Shan Wang Profile

Dr. Wei-Shan Wang

at Fraunhofer ENAS

SPIE Involvement:

Author

Publications (4)

Proceedings Article | 26 April 2016 Paper

Vertical integration of array-type miniature interferometers at wafer level by using multistack anodic bonding

Wei-Shan Wang, Maik Wiemer, Joerg Froemel, Tom Enderlein, Thomas Gessner, Justine Lullin, Sylwester Bargiel, Nicolas Passilly, Jorge Albero, Christophe Gorecki

Proceedings Volume 9890, 989011 (2016) https://doi.org/10.1117/12.2229884

KEYWORDS: Semiconducting wafers, Interferometers, Microelectromechanical systems, Microlens, Mirau interferometers, Wafer bonding, Microopto electromechanical systems, Optical coherence tomography, Scanners, Beam splitters, Laser cutting, Gold, Glasses

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Proceedings Article | 26 April 2016 Paper

Array-type miniature interferometer as the core optical microsystem of an optical coherence tomography device for tissue inspection

Nicolas Passilly, Stéphane Perrin, Justine Lullin, Jorge Albero, Sylwester Bargiel, Luc Froehly, Christophe Gorecki, Johann Krauter, Wolfgang Osten, Wei-Shan Wang, Maik Wiemer

Proceedings Volume 9890, 98900C (2016) https://doi.org/10.1117/12.2229477

KEYWORDS: Skin, Microopto electromechanical systems, Optical coherence tomography, Microsystems, Mirrors, Silicon, Semiconducting wafers, Beam splitters

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Proceedings Article | 27 February 2015 Paper

Technological platform for vertical multi-wafer integration of miniature imaging instruments

S. Bargiel, M. Baranski, N. Passilly, C. Gorecki, M. Wiemer, J. Frömel, D. Wünsch, W. Wang

Proceedings Volume 9375, 93750L (2015) https://doi.org/10.1117/12.2078007

KEYWORDS: Glasses, Silicon, Microlens, Semiconducting wafers, Wafer-level optics, Confocal microscopy, Etching, Microscopes, Microopto electromechanical systems, Beam splitters

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Proceedings Article | 27 February 2015 Paper

Multi-wafer bonding technology for the integration of a micromachined Mirau interferometer

Wei-Shan Wang, Justine Lullin, Joerg Froemel, Maik Wiemer, Sylwester Bargiel, Nicolas Passilly, Christophe Gorecki, Thomas Gessner

Proceedings Volume 9375, 93750P (2015) https://doi.org/10.1117/12.2077641

KEYWORDS: Semiconducting wafers, Wafer bonding, Interfaces, Mirau interferometers, Microopto electromechanical systems, Microlens, Glasses, Silicon, Optical coherence tomography, Wafer-level optics

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