Dr. Chungen Zah
SPIE Involvement:
Conference Program Committee | Author
Publications (48)

Proceedings Article | 14 March 2023 Poster + Paper
Yingmin Fan, Hao Zhang, Jiayan Yang, Peng Wang, Wenfang Zhang, Yixiao He, Xiaoyu Tian, Tuanwei Fu, Guopeng Zhang, Chung-en Zah, Xingsheng Liu
Proceedings Volume 12403, 124030T (2023) https://doi.org/10.1117/12.2650886
KEYWORDS: LIDAR, Beam divergence, Reliability, Design and modelling, Laser applications, Light sources, Laser bonding, Edge emitting semiconductor lasers, High power diode lasers, Laser sources

Proceedings Article | 4 March 2022 Presentation + Paper
Proceedings Volume 11982, 119820F (2022) https://doi.org/10.1117/12.2608536
KEYWORDS: Waveguides, Semiconductor lasers, Laser systems engineering, Semiconducting wafers, Annealing, Homogenization, Near field optics, Optical simulations

Proceedings Article | 4 March 2022 Presentation + Paper
Proceedings Volume 11982, 1198203 (2022) https://doi.org/10.1117/12.2609183
KEYWORDS: Heatsinks, Continuous wave operation, Packaging, Optical simulations, Semiconductor lasers, High power lasers, Laser bonding

Proceedings Article | 4 March 2022 Poster + Presentation + Paper
Proceedings Volume 11983, 119830R (2022) https://doi.org/10.1117/12.2608522
KEYWORDS: Semiconductor lasers, Resistance, Convection, Reliability, Laser development, Thermal modeling, Pulsed laser operation, Laser bonding, High power lasers

Proceedings Article | 9 October 2021 Paper
Proceedings Volume 11891, 118910S (2021) https://doi.org/10.1117/12.2601633
KEYWORDS: Vertical cavity surface emitting lasers, Transmitters, LIDAR, Temperature metrology, Light sources, Mirrors, Fiber optic illuminators, Light sources and illumination, Image transmission, Reliability

Showing 5 of 48 publications
Proceedings Volume Editor (1)

SPIE Conference Volume | 31 January 2005

Conference Committee Involvement (12)
Components and Packaging for Laser Systems X
29 January 2024 | San Francisco, California, United States
Components and Packaging for Laser Systems IX
30 January 2023 | San Francisco, California, United States
Components and Packaging for Laser Systems VIII
24 January 2022 | San Francisco, California, United States
Components and Packaging for Laser Systems VII
6 March 2021 | Online Only, California, United States
Components and Packaging for Laser Systems VI
3 February 2020 | San Francisco, California, United States
Showing 5 of 12 Conference Committees
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